公开(公告)号：US20250029931A1

公开(公告)日：2025-01-23

申请号：US18453720

申请日：2023-08-22

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Amendra Koul ,  David Nozadze ,  Joel Richard Goergen ,  Sayed Ashraf Mamun ,  Srinath Penugonda

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/522 ,  H01L25/00 ,  H01L25/10

Abstract: In some embodiments, an integrated circuit (IC) includes multiple packages that are separate from one another. Each package includes a pad, and a core via is electrically coupled to the pads of the separate packages to electrically couple the packages to one another. At least one of the pads includes an oblong shape to match its impedance with the impedance of the core via.