-
公开(公告)号:JPS62163765A
公开(公告)日:1987-07-20
申请号:JP6699786
申请日:1986-03-25
Applicant: COMP GENERALE ELECTRICITE , ELF AQUITAINE
Inventor: KURISUCHIYAN BERUE
-
公开(公告)号:JPS598612A
公开(公告)日:1984-01-17
申请号:JP11414083
申请日:1983-06-24
Applicant: Comp Generale Electricite
Inventor: KURISUCHIYAN BERUE
IPC: C01B33/02 , C30B15/00 , C30B29/64 , C30B33/00 , H01L21/208 , H01L31/0248
CPC classification number: C30B15/007 , C30B33/00 , Y10S117/914 , Y10S117/915
-
公开(公告)号:JPS60108311A
公开(公告)日:1985-06-13
申请号:JP17820284
申请日:1984-08-27
Applicant: COMP GENERALE ELECTRICITE , ELF AQUITAINE
Inventor: MISHIERU MOTOREFU , KURISUCHIYAN BERUE
-
4.Method and device for bonding semiconductor material layer to tape 失效
Title translation: 用于将半导体材料层粘合到带的方法和装置公开(公告)号:JPS6147629A
公开(公告)日:1986-03-08
申请号:JP17099385
申请日:1985-08-02
Applicant: Comp Generale Electricite , Elf Aquitaine
Inventor: KURISUCHIYAN BERUE
CPC classification number: C04B41/009 , C04B41/4505 , C04B41/81 , C23C2/40 , C30B15/007 , C30B15/24 , C04B41/50 , C04B41/5022 , C04B35/52
-
公开(公告)号:JPS60232272A
公开(公告)日:1985-11-18
申请号:JP17914784
申请日:1984-08-28
Applicant: COMP GENERALE ELECTRICITE , ELF AQUITAINE
Inventor: KURISUCHIYAN BERUE
-
公开(公告)号:JPS5888116A
公开(公告)日:1983-05-26
申请号:JP19666982
申请日:1982-11-09
Applicant: COMP GENERALE ELECTRICITE
Inventor: KURISUCHIYAN BERUE
-
-
-
-
-