公开(公告)号：WO2011133813A2

公开(公告)日：2011-10-27

申请号：PCT/US2011/033492

申请日：2011-04-21

Applicant: COOPER TECHNOLOGIES COMPANY ,  LEHMAN, Gregg, Arthur ,  CARNEY, Anthony, James ,  PATRICK, Ellis ,  CHAN, Chun, Wah ,  LADEWIG, Christopher ,  WRIGHT, Timothy, Glen, Wright

Inventor： LEHMAN, Gregg, Arthur ,  CARNEY, Anthony, James ,  PATRICK, Ellis ,  CHAN, Chun, Wah ,  LADEWIG, Christopher ,  WRIGHT, Timothy, Glen, Wright

IPC: F21S2/00 ,  F21V5/00 ,  F21Y101/02

CPC classification number: F21V23/023 ,  F21K9/20 ,  F21K9/60 ,  F21K9/90 ,  F21S8/03 ,  F21V5/007 ,  F21V17/101 ,  F21V17/12 ,  F21V19/003 ,  F21V23/002 ,  F21V29/76 ,  F21V29/763 ,  F21V31/005 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05K1/0287 ,  H05K2201/10106

Abstract: A light emitting diode (LED) module having a configurable LED substrate capable of receiving varying numbers and layouts of LEDs are described herein. The LED substrate includes LED coupling points for receiving the LEDs and electrical traces etched into the substrate for routing power to the LEDs. The LED module can include a multi-LED over-optic having multiple over-optics that are configured to match the number and configuration of the LEDs positioned on the substrate. The LED coupling points and over- optics can be arranged symmetrically to enable the LED module to be rotated to adjust the light output distribution and direction. The LED module can include a power connection mechanism, for example located at the center of the substrate, that also allows the LED module to be rotated. One or more of the LED modules may be mounted on a heat sink and incorporated into a light fixture.

Abstract translation: 本文描述了具有能够接收不同数量和LED布局的可配置LED基板的发光二极管（LED）模块。 LED基板包括用于接收LED的LED耦合点和蚀刻到基板中的电迹线以将功率路由到LED。 LED模块可以包括具有多个超光学器件的多LED超光学器件，其被配置为匹配位于衬底上的LED的数量和配置。 可以对称地布置LED耦合点和光学元件，以使LED模块能够旋转以调节光输出分布和方向。 LED模块可以包括例如位于基板中心的电力连接机构，其也允许LED模块旋转。 一个或多个LED模块可以安装在散热器上并且并入到灯具中。

公开(公告)号：WO2011066421A2

公开(公告)日：2011-06-03

申请号：PCT/US2010/058048

申请日：2010-11-24

Applicant: COOPER TECHNOLOGIES COMPANY ,  DAVIS, Matthew, A. ,  BRADFORD, Reed, Alan ,  PATRICK, Ellis

Inventor： DAVIS, Matthew, A. ,  BRADFORD, Reed, Alan ,  PATRICK, Ellis

IPC: F21V17/00 ,  F21V13/00 ,  F21S2/00

CPC classification number: F21K9/50 ,  B29C45/14467 ,  B29C45/14639 ,  B29C65/48 ,  B29C65/483 ,  B29C66/45 ,  B29C66/474 ,  F21K9/90 ,  F21S2/005 ,  F21S4/28 ,  F21V5/007 ,  F21V5/04 ,  F21V17/101 ,  F21V31/03 ,  F21Y2105/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H05K3/30 ,  Y10T29/4913

Abstract: A light module includes one or more LEDs coupled to a circuit board, a lens disposed over at least one LED, and an adhesive layer disposed between each LED and the lens. A flange extends from at least one side of the lens. The adhesive layer fixes the lens in an optical alignment over the corresponding LED. The adhesive layer includes at least one of a non-permeable layer with an adhesive material on the top and bottom surfaces, a gas-permeable layer with an adhesive material on the top and bottom surfaces, a deposited material, and an over mold material. An alignment tool including one or more optical recesses and one or more alignment features is used in the assembly of at least one of an optical assembly and a light module that includes the optical assembly. The alignment tool facilitates precise alignment of the lenses over the LEDs.

Abstract translation: 发光模块包括耦合到电路板的一个或多个LED，设置在至少一个LED上的透镜以及设置在每个LED和透镜之间的粘合剂层。 凸缘从透镜的至少一侧延伸。 粘合剂层将光学对准地固定在相应的LED上。 粘合剂层包括在顶部和底部表面上具有粘合剂材料的不可渗透层，在顶部和底部表面上具有粘合剂材料的透气层，沉积材料和包覆模制材料中的至少一种。 包括一个或多个光学凹槽和一个或多个对准特征的对准工具被用于包括光学组件的光学组件和光模块中的至少一个的组装中。 对准工具有助于镜头在LED上精确对准。

公开(公告)号：EP2561265A2

公开(公告)日：2013-02-27

申请号：EP11772731.3

申请日：2011-04-21

Applicant: Cooper Technologies Company

Inventor： LEHMAN, Gregg, Arthur ,  CARNEY, Anthony, James ,  PATRICK, Ellis ,  CHAN, Chun, Wah ,  LADEWIG, Christopher ,  WRIGHT, Timothy, Glen, Wright ,  BRYANT, Christopher Michael ,  DIEGUES, Victor

IPC: F21S2/00 ,  F21V5/00 ,  F21Y101/02

CPC classification number: F21V23/023 ,  F21K9/20 ,  F21K9/60 ,  F21K9/90 ,  F21S8/03 ,  F21V5/007 ,  F21V17/101 ,  F21V17/12 ,  F21V19/003 ,  F21V23/002 ,  F21V29/76 ,  F21V29/763 ,  F21V31/005 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05K1/0287 ,  H05K2201/10106

Abstract: A light emitting diode (LED) module having a configurable LED substrate capable of receiving varying numbers and layouts of LEDs are described herein. The LED substrate includes LED coupling points for receiving the LEDs and electrical traces etched into the substrate for routing power to the LEDs. The LED module can include a multi-LED over-optic having multiple over-optics that are configured to match the number and configuration of the LEDs positioned on the substrate. The LED coupling points and over- optics can be arranged symmetrically to enable the LED module to be rotated to adjust the light output distribution and direction. The LED module can include a power connection mechanism, for example located at the center of the substrate, that also allows the LED module to be rotated. One or more of the LED modules may be mounted on a heat sink and incorporated into a light fixture.

Abstract translation: 本文描述了具有能够接收不同数量和LED布局的可配置LED基板的发光二极管（LED）模块。 LED基板包括用于接收LED的LED耦合点和蚀刻到基板中的电迹线以将功率路由到LED。 LED模块可以包括具有多个超光学器件的多LED过光学器件，其被配置为匹配位于衬底上的LED的数量和配置。 可以对称地布置LED耦合点和过光学元件，以使LED模块能够旋转以调节光输出分布和方向。 LED模块可以包括电源连接机构，例如位于基板的中心，也允许LED模块旋转。 一个或多个LED模块可以安装在散热器上并且并入到灯具中。