公开(公告)号：US20140355225A1

公开(公告)日：2014-12-04

申请号：US14292876

申请日：2014-05-31

Applicant: Cytec Industries Inc.

Inventor： Richard David Jordan, JR. ,  Thomas C. Scanlon, IV

IPC: H05K1/03 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K3/284 ,  C08G2/10 ,  C08G18/246 ,  C08G18/36 ,  C08G18/4825 ,  C08G18/7664 ,  C09D175/04 ,  H05K3/285 ,  H05K2201/09872 ,  C08G18/10

Abstract: Formulated resin systems containing polymeric flood coat compositions are provided herein and characterized by having an initial mix thixotropic index from 1 to 5, and a gel time from 5 to 15 minutes such that when cured the compositions provide a Shore hardness from 15 A to 90 A, a thickness on horizontal surfaces from 20 mils to 75 mils, and a thickness on vertical surfaces from 4 mils to 20 mils. Electronic circuit assemblies flood coated with such formulated resin systems, and methods for protecting and supporting said assemblies, are also provided.

Abstract translation: 本文提供了含有聚合物防水涂料组合物的配制树脂体系，其特征在于具有1至5的初始混合物触变指数和5至15分钟的凝胶时间，使得当固化时，组合物提供肖氏硬度为15A至90A ，水平表面上的厚度为20密耳至75密耳，垂直表面上的厚度为4密耳至20密耳。 还提供了用这种配制的树脂体系浸涂的电子电路组件，以及用于保护和支撑所述组件的方法。

公开(公告)号：US20150077947A1

公开(公告)日：2015-03-19

申请号：US14556116

申请日：2014-11-29

Applicant: Cytec Industries Inc.

Inventor： Richard David Jordan, JR. ,  Thomas C. Scanlon, IV

IPC: H05K1/02 ,  H05K7/14

CPC classification number: H05K7/1427 ,  C08G18/246 ,  C08G18/4825 ,  C08G18/7664 ,  C08G18/8067 ,  C08G59/00 ,  C08G59/184 ,  C08G77/04 ,  C08L33/08 ,  C08L33/10 ,  C09D133/08 ,  C09D133/10 ,  C09D175/04 ,  C09D183/04 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/09872 ,  C08G18/10 ,  C08G18/36

Abstract: Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

Abstract translation: 提供了如本文所述或示例的聚合物防水涂料组合物泛涂的电路组件。 泛涂层组合物的特征在于具有足够的凝胶时间和触变指数，以便在固化时基本上将电路组件覆盖或封装为固定质量，使得水平于组件的表面上的聚合物涂层的厚度为20密耳至 75密耳，垂直于组件的表面上的厚度为4密耳至20密耳。 这种包覆涂层的组件和包含其的装置优于常规灌封材料或保形涂层，因为它们需要更少的材料，从而减轻重量和成本，并且它们能够承受极端的环境应力，例如温度和/或振动。