公开(公告)号：US09884942B2

公开(公告)日：2018-02-06

申请号：US14356173

申请日：2012-12-20

Applicant: Cytec Industries Inc.

Inventor： Steven Richard Ward ,  Paul Mark Cross ,  Robin Maskell

IPC: C08G69/26 ,  C08G75/205 ,  C08L79/08 ,  C08G75/23 ,  C08K7/04 ,  C08K7/06 ,  C08K7/10 ,  C08K7/14 ,  C08L81/06 ,  C08K5/42

CPC classification number: C08G75/205 ,  C08G75/23 ,  C08K5/41 ,  C08K5/42 ,  C08K7/04 ,  C08K7/06 ,  C08K7/10 ,  C08K7/14 ,  C08L79/085 ,  C08L81/06

Abstract: A curable polymer composition comprising: (A) a thermoset maleimide resin precursor component; and further comprising one or both of: (B) an arylsulphone-containing maleimide component; and (C) a polyarylpolymer thermoplastic toughening agent component, wherein in the absence of component (B), said component (C) comprises one or more maleimide pendant and/or end groups, and thermoset resins and composites derived therefrom.

公开(公告)号：US20140309352A1

公开(公告)日：2014-10-16

申请号：US14356173

申请日：2012-12-20

Applicant: Cytec Industries Inc.

Inventor： Steven Richard Ward ,  Paul Mark Cross ,  Robin Maskell

IPC: C08G75/20 ,  C08G75/23 ,  C08K7/14 ,  C08K7/06 ,  C08K7/10 ,  C08L81/06 ,  C08K7/04

CPC classification number: C08G75/205 ,  C08G75/23 ,  C08K5/41 ,  C08K5/42 ,  C08K7/04 ,  C08K7/06 ,  C08K7/10 ,  C08K7/14 ,  C08L79/085 ,  C08L81/06

Abstract: A curable polymer composition comprising: (A) a thermoset maleimide resin precursor component; and further comprising one or both of: (B) an arylsulphone-containing maleimide component; and (C) a polyarylpolymer thermoplastic toughening agent component, wherein in the absence of component (B), said component (C) comprises one or more maleimide pendant and/or end groups, and thermoset resins and composites derived therefrom.

Abstract translation: 一种可固化聚合物组合物，其包含：（A）热固性马来酰亚胺树脂前体组分; 并且还包括以下之一或两者：（B）含芳基砜的马来酰亚胺组分; 和（C）聚芳基聚合物热塑性增韧剂组分，其中在不存在组分（B）的情况下，所述组分（C）包含一种或多种马来酰亚胺侧基和/或端基，以及由其衍生的热固性树脂和复合材料。