Abstract:
PROBLEM TO BE SOLVED: To provide a cationically polymerizable resin composition having low viscosity and easy processability, and extremely quickly curable by light irradiation to give a cured product excellent in softness, heat-resistance and flexibility after heat-treatment. SOLUTION: The cationically polymerizable resin composition contains (A) a vinyl ether compound containing an oxetane ring and/or (B) a vinyl ether compound containing an alicyclic epoxy group, and (C) an oligomer or polymer of a specific (meth)acrylic acid ester (co)polymer having oxetane rings or epoxy rings, exhibiting a liquid state at 0°C and having a molecular weight of ≥500. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a useful maleimide copolymer as a resist resin excellent in the drying etching resistance. SOLUTION: The copolymer contains the units represented by the formulas (1) and (2) [R is an alkyl group which may have a substituted group; Z ring is a lactone ring; x is an integer of 0-3]. Further, it may contain at least one unit selected from (meth)acrylic acid or its ester and, maleic anhydride or its ester. The copolymer is useful as a resist composition combined with an optical acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To obtain a polymer compound for photoresist, containing uniformly distributed monomer units, having small intramolecular and intermolecular compositional distributions and exhibiting excellent etching resistance. SOLUTION: The polymer compound for photoresist is produced by the copolymerization of a monomer mixture containing three kinds of (meth)acrylic acid esters comprising (A) a compound of formula 1, (B) a compound of formula 2 and/or 3 and (C) a (meth)acrylic acid ester of formula 4 having a substituted adamantane ring (R2, R12 and R13 are each H or a 1-3C hydrocarbon group; R14 is a 6-20C bridged alicyclic hydrocarbon group; R16 is methyl or the like; R18 and R19 are each H, hydroxy group, oxo group or carboxy group provided that R18 and R19 are not H at the same time; (p), (q), (r) and (s) are each 0 or 1; and p+q+r+s is 2-4).
Abstract:
PROBLEM TO BE SOLVED: To obtain a polymeric compound which not only is excellent in clarity, alkali resistance, and adhesive properties but also has a high etching resistance. SOLUTION: This polymeric compound contains at least one of monomer units represented by formula I (wherein R1 is H or methyl; and R2 and R3 are each H or hydroxyl) and may further contain at least one of monomer units selected from among monomer units represented by formulas II a and II b (wherein R1 is H or methyl; R4 and R5 are each H, hydroxyl, oxo, carboxyl, or the like provided they are not simultaneously H; and R7 and R8 are each H, hydroxyl, or oxo).
Abstract:
PURPOSE:To provide such a plate material for printing that drawing is enabled on the surface even by low laser energy and strength is large by providing both a photosensitive layer containing nitrocellulose, carbon black and bound resin and a supporting body consisting of a PET film having specified average density. CONSTITUTION:A form plate material for printing is constituted of a supporting body and a photosensitive layer containing nitrocellulose, carbon black and bound resin. The supporting body is formed of a PET film having average density less than 1.39. Thereby, since strength of heat decomposable photosensitive layer is large and strength of the PET film being the supporting body is large, durability of the plate material for printing is enhanced. Therefore the plate material for printing is obtained in which drawing is enabled on the surface even by application of low laser energy and strength is large.
Abstract:
PURPOSE:To smoothly produce high-quality fiber having hardly any unevenness of denier without causing yarn breakage by a spinneret being uniform in the length of capillary in a spinning hole. CONSTITUTION:This spinneret forms plural spinning holes 5 consisting of inversely conical introducing parts 9 and columnar discharge parts 10 formed in the lower part of the introducing part 9 in a spinneret plate 1. In this spinneret, the spinneret plate 1 is formed by laminating an introducing plate 2 in which an introducing hole corresponding to the introducing part 9 is bored to a discharge plate 3 in which a discharge hole corresponding to the discharge part 10 is bored. A reinforced plate 4 forming a hole 11 larger than hole diameter of the discharge hole at a position corresponding to the discharge hole may be laminated to the discharge plate 3. The introducing plate 2, the discharge plate 3 and reinforced plate 4 may be separable, respectively. In this spinneret, the discharge part having uniform length is obtained, because these plates can separately be produced.
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for positive photoresist, in which a polymer itself can be solubilized upon irradiation with light, even if the polymer has an adamantane skeleton, and which has high etching resistance (in particular, high dry etching resistance) and can form a fine pattern, using a simple composition with high accuracy. SOLUTION: The resin composition for photoresist contains the polymer, having a unit represented by formula (1) and a photoacid generator. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an insulation film without having unevenness in insulation property, having a uniform film quality and having an extremely low specific resistivity, and an insulation film-forming material capable of forming the same. SOLUTION: This insulation film-forming material consisting of a polymerizable composition obtained by dissolving a polymerizable compounds including a compound having an adamantane skeleton is characterized by having COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a material forming a polybenzazole insulating film which has high heat resistance and a low dielectric constant and is useful for a semiconductor part and the like. SOLUTION: The insulating film-forming material comprises a polymerizable composition obtained by dissolving an adamantane polycarboxylic acid represented by formula (1) (wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y 1 , Y 2 , Y 3 and Y 4 are the same or different and are each a single bond or a divalent aromatic cyclic group) and an aromatic polyamine represented by formula (2) (wherein the ring Z is a monocyclic or polycyclic aromatic ring; and R 1 and R 2 are each a substituent group bonded to the ring Z and are, same or different, an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group) in a solvent other than a ketone and an aldehyde. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a fine pattern by using a resin composition for a photoresist having high etching solution resistance and capable of being solubilized by photoirradiation. SOLUTION: The adamantane-based monomer for a photoresist is represented by formula (1b), wherein, R 11 is H or methyl, R 12 , R 13 and R 14 are the same or different from each other and are each H, an alkyl or hydroxy, at least one of R 12 , R 13 and R 14 is hydroxy, X is a connecting group and m and n are each 0 or 1. The resin composition for a photoresist can be solubilized by photoirradiation, is useful for forming a fine pattern, has an adamantane skeleton, has high etching resistance and is capable of forming a fine pattern with a simple composition at a high resolution. COPYRIGHT: (C)2005,JPO&NCIPI