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    CRYSTAL VIBRATION DEVICE
    5.
    发明公开
    CRYSTAL VIBRATION DEVICE 有权
    晶体谐振器

    公开(公告)号：EP1187323A4

    公开(公告)日：2005-04-06

    申请号：EP01908254

    申请日：2001-03-02

    Applicant: DAISHINKU CORP

    Inventor： IIZUKA MINORU ,  ISHIHARA HIROYUKI ,  OGASAWARA YOSHIKIYO ,  MORI AKIHIRO ,  HIRAO SUSUMU ,  MURAKAMI TATSUYA

    IPC: H03H9/13

    CPC classification number: H03H9/0509 ,  H03H9/0519 ,  H03H9/131

    Abstract: A crystal vibration device comprising a crystal diaphragm formed on the opposite main surfaces thereof with exciting electrodes and extraction electrodes extracted from respective exciting electrodes, and an electrode pad formed on a base and electrically connected with the crystal diaphragm via a silicon-based conductive adhesive. Each of at least extraction electrodes, out of the exciting electrodes and the extraction electrodes, comprises a Cr film layer, an Au film layer, and a Cr thin film layer or an Ag thin film layer sequentially laminated on the crystal diaphragm. The electrode pad comprises a tungsten- or molybdenum-made metallized layer, a Ni film layer and an Au film layer sequentially laminated on the base, and at least a specified region, to which a silicon conductive adhesive is applied, in the Au film layer of the electrode pad is diffused with Ni in the Ni film layer.

    Hermetic seal apparatus for electronic component
    6.
    发明专利
    Hermetic seal apparatus for electronic component 有权
    电子元器件的密封密封装置

    公开(公告)号：JP2007227689A

    公开(公告)日：2007-09-06

    申请号：JP2006047619

    申请日：2006-02-24

    Applicant: Daishinku Corp ,  株式会社大真空

    Inventor： OGASAWARA YOSHIKIYO ,  MURAKAMI TATSUYA

    IPC: H01L23/02 ,  H01R43/20 ,  H03H3/02

    Abstract: PROBLEM TO BE SOLVED: To provide a hermetic seal apparatus for an electronic component capable of improving the productivity and the quality thereof. SOLUTION: This hermetic seal apparatus 1 comprises a control processor 11 and a hermetic chamber 12. A heater 12a and a sealing jig 12b installed on the heater 12a are provided in the hermetic chamber, and a temperature sensor 12c such as a thermocouple etc. is also mounted on the heater 12a. A control unit 11a, a pump 11b and a power supply are provided in the control processor 11. One or more sets of an input/output interface (terminals for control) for carrying out electric control and a piping interface (piping port) for controlling the atmosphere are provided in the control processor 11. An additional hermetic chamber (additional unit) is connected via respective interfaces, and the operation thereof is controlled. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种能够提高生产率和质量的电子部件的气密密封装置。 解决方案：这种气密密封装置1包括控制处理器11和密封室12.安装在加热器12a上的加热器12a和密封夹具12b设置在密封室中，并且诸如热电偶的温度传感器12c 等也安装在加热器12a上。 控制单元11a，泵11b和电源设置在控制处理器11中。一组或多组用于执行电气控制的输入/输出接口（用于控制的端子）和用于控制的管道接口（管道端口） 气氛被提供在控制处理器11中。另外的密封室（附加单元）经由各个接口连接，并且其操作被控制。 版权所有（C）2007，JPO＆INPIT

    Crystal oscillation device
    7.
    发明专利
    Crystal oscillation device 有权
    水晶振荡装置

    公开(公告)号：JP2005237041A

    公开(公告)日：2005-09-02

    申请号：JP2005139589

    申请日：2005-05-12

    Applicant: Daishinku Corp ,  株式会社大真空

    Inventor： IIZUKA MINORU ,  ISHIHARA HIROMASA ,  OGASAWARA YOSHIKIYO ,  MORI AKIHIRO ,  HIRAO SUSUMU ,  MURAKAMI TATSUYA

    IPC: H03H9/10 ,  H03H9/02

    Abstract: PROBLEM TO BE SOLVED: To maintain proper adhesion state and adhesive strength, and improve shock-resistance, even if a crystal vibration plate is jointed to the electrode pad of a base, using a silicon-based conductive adhesive.
    SOLUTION: The crystal vibration plate, by which a lead-out electrode led out from a driven electrode and each driven electrode has been formed in both the principal planes and the electrode pad formed on the base are electrically connected with the lead-out electrode via the silicon-based conductive adhesives. The electrode pad is sequentially laminated in the order of a metallized layer, a Ni film layer, an Au film layer, an Ag thin-film layer or an Al thin-film layer which comprises tungsten or molybdenum, on the base.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：即使使用硅基导电粘合剂将晶体振动板连接到基座的电极焊盘上，为了保持适当的粘附状态和粘合强度，并且提高抗冲击性。 解决方案：在主平面中形成从驱动电极引出的引出电极和每个驱动电极的晶体振动板与形成在基座上的电极焊盘电连接， 通过硅基导电粘合剂的电极。 电极焊盘按照金属化层，Ni膜层，Au膜层，Ag薄膜层或包含钨或钼的Al薄膜层的顺序依次层叠在基材上。 版权所有（C）2005，JPO＆NCIPI

    AIR-TIGHT SEALING METHOD OF PACKAGE FOR ELECTRONIC COMPONENT
    8.
    发明专利
    AIR-TIGHT SEALING METHOD OF PACKAGE FOR ELECTRONIC COMPONENT 失效

    公开(公告)号：JP2002176116A

    公开(公告)日：2002-06-21

    申请号：JP2000370726

    申请日：2000-12-05

    Applicant: DAISHINKU CORP

    Inventor： OGASAWARA YOSHIKIYO ,  IIZUKA MINORU

    IPC: H01L23/02

    Abstract: PROBLEM TO BE SOLVED: To provide an air-tight sealing method of package for electronic component which uses ultra-small size electronic components, reduces manufacturing cost and does not deteriorate electrical characteristics. SOLUTION: A ceramic package, in which a crystal-controlled oscillator 3 is accommodated and a cap 2 is also loaded to the predetermined positions of a component loading portion S, is positioned and disposed using a jig or the like. A press tool T is heated up to the predetermined temperature with a heating portion D2 of a high frequency heater, the component loading portion S is moved upward under this condition, and a contact portion T1 and the cap 2 are pressurized in contact to realize the air-tight sealing.

    Lid, base and package for electronic component
    9.
    发明专利
    Lid, base and package for electronic component 审中-公开
    电子元件的LID，基座和封装

    公开(公告)号：JP2011228353A

    公开(公告)日：2011-11-10

    申请号：JP2010094270

    申请日：2010-04-15

    Applicant: Daishinku Corp ,  株式会社大真空

    Inventor： OGASAWARA YOSHIKIYO

    IPC: H01L23/02 ,  H03H9/02

    Abstract: PROBLEM TO BE SOLVED: To provide a lid and a package for an electronic component that improve heat resistance at a hermetic seal portion of the package for the electronic component to obtain stable characteristics of the electronic component.SOLUTION: A lid 3 has a rectangular shape in a plan view and comprises many layers of metal materials and a core portion 30 where a metal brazing portion 31 is formed on the surface thereof. The metal brazing portion 31 has a lower brazing portion 31a, an upper brazing portion 31b. A nickel film is formed on the surface of the metal brazing portion 31. A base 1 is an open-topped box having a rectangular solid outer shape as a whole and comprises a bottom portion 10, a bank portion 11, a step portion 1c and a storage portion of an electric component element which basically has a convex cross section. The lid 3 is placed on the base 1 so that the opening of the base 1 is sealed by fitting the metal brazing portion 31 on top of the bank portion 11.

    Abstract translation: 解决的问题：提供一种用于电子部件的盖和包装，其改善电子部件的包装的气密密封部分的耐热性，以获得电子部件的稳定特性。 解决方案：盖3在平面图中具有矩形形状，并且包括多层金属材料和在其表面上形成金属钎焊部分31的芯部30。 金属钎焊部31具有下钎焊部31a，上钎焊部31b。 在金属钎焊部分31的表面上形成镍膜。底座1是整体具有矩形固体外形的开顶盒，包括底部10，堤部分11，台阶部分1c和 电气元件的存储部分基本上具有凸形横截面。 将盖3放置在基座1上，从而通过将金属钎焊部分31装配到堤岸部分11的顶部来密封基座1的开口。版权所有（C）2012，JPO＆INPIT

    Lid, base and package for electronic component
    10.
    发明专利
    Lid, base and package for electronic component 审中-公开
    电子元件的LID，基座和封装

    公开(公告)号：JP2011228352A

    公开(公告)日：2011-11-10

    申请号：JP2010094269

    申请日：2010-04-15

    Applicant: Daishinku Corp ,  株式会社大真空

    Inventor： OGASAWARA YOSHIKIYO

    IPC: H01L23/02 ,  H03H9/02

    Abstract: PROBLEM TO BE SOLVED: To provide a lid and a package for an electronic component that improve heat resistance at a hermetic seal portion of the package for the electronic component to obtain stable characteristics of the electronic component.SOLUTION: A lid 3 has a rectangular shape in a plan view and comprises a plurality of layers of metal materials and a core portion 30 where a metal brazing portion 31 is formed on the surface thereof. The metal brazing portion 31 has a lower brazing portion 31a, an upper brazing portion 31b and a plurality of concave portions 311. The concave portion 311 consists of the upper brazing portion 31b which is bottomless and the lower brazing portion 31a which has a bottom, and is formed of, as a whole, a convex shape having many small openings with bottoms. A base 1 is an open-topped box having a rectangular solid outer shape as a whole and includes a bottom portion 10, a bank portion 11, a step portion 1c and a storage portion of an electric component element which basically has a convex cross section. The lid 3 is placed on the base 1 so that the opening of the base 1 is sealed by fitting the metal brazing portion 31 on top of the bank portion 11.

    Abstract translation: 解决的问题：提供一种用于电子部件的盖和包装，其改善电子部件的包装的气密密封部分的耐热性，以获得电子部件的稳定特性。 解决方案：盖3在平面图中具有矩形形状，并且包括多层金属材料和在其表面上形成金属钎焊部分31的芯部30。 金属钎焊部31具有下钎焊部31a，上钎焊部31b和多个凹部311.凹部311由无底的上钎焊部31b和具有底部的下钎焊部31a构成， 并且由整体形成具有许多具有底部的小开口的凸形。 基座1是整体具有矩形实心外形的开顶盒，包括底部10，堤部11，台阶部分1c和基本上具有凸形横截面的电气元件的存放部分 。 将盖3放置在基座1上，从而通过将金属钎焊部分31装配到堤岸部分11的顶部来密封基座1的开口。版权所有（C）2012，JPO＆INPIT

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