公开(公告)号：WO2023043662A1

公开(公告)日：2023-03-23

申请号：PCT/US2022/043009

申请日：2022-09-09

Applicant: DANFOSS A/S

Inventor： SONG, Danny ,  LI, Tianlei ,  KRAMER, Hunter ,  DATLA, Soma Lakshmi Satya Sravan Bala Varma

IPC: H01L23/34 ,  H01L23/473 ,  F28F1/12 ,  H01L23/36 ,  H01L23/46 ,  H01L23/467 ,  F28F3/02

Abstract: A refrigerant system according to an example of this disclosure includes a main refrigerant loop in communication with a condenser, an evaporator, and a compressor. A heat exchanger is arranged to cool electronic components. The heat exchanger has a cooling line, which is configured to receive refrigerant from the main refrigerant loop and a heat sink in communication with air surrounding the electronic components.