公开(公告)号：DE1621232A1

公开(公告)日：1970-07-23

申请号：DE1621232

申请日：1967-08-18

Applicant: DEGUSSA

Inventor： HELMUT KNORRE DR ,  GUENTER REIFF DR

IPC: C23C18/20

公开(公告)号：DE1521210A1

公开(公告)日：1970-04-09

申请号：DE1521210

申请日：1965-11-12

Applicant: DEGUSSA

Inventor： KALLRATH GOTTFRIED ,  HANNS BIEGLER DR ,  HELMUT KNORRE DR ,  EUGEN MEYER-SIMON DR

IPC: C23C18/16 ,  C23C18/20 ,  B44D1/092

Abstract: 1,164,459. Coating with metals. DEUTSCHE GOLD-UND SILBER-SCHEIDEANSTALT. Nov.11, 1966 [Nov.12, 1965], No.50754/66. Heading C7F. In the electroless plating of a non-conductor e.g. PVC, polyethylene,polypropylene, cellulose hydrate or rubber with e. g. Cu, Ni or Cr, from 10 to 50% by weight of a filler is worked into the non-conductor before plating, the filler, e. g. silicas with Si-H bonds, metal oxides or alkali- or alkaline earth metal silicates or aluminosilicates, is such as will combine with a plating catalyst e. g. Pd or Ag, either before or after mixing with the non-conductor. The non-conductor may be applied to a metal, e. g. Fe or Al, substrate and the electroless coating may be subsequently electroplated. In an example silica with 6% silanol is worked into polythene, the formed resin is dipped in sulphuric acid, rinsed, immersed in an ammoniacal solution or Pd C1 2 and then plated.

公开(公告)号：DE1615961A1

公开(公告)日：1970-06-25

申请号：DE1615961

申请日：1967-04-12

Applicant: DEGUSSA

Inventor： HELMUT KNORRE DR ,  EUGEN MEYER-SIMON DR ,  KALLRATH GOTTFRIED ,  HANNS BIGLER DR

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  C25D5/02 ,  D06Q1/04 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H05K1/00

Abstract: 1,195,512. Printed circuits. DEUTSCHE GOLD - UND SILBER - SCHEIDEANSTALT. 10 April, 1968 [12 April, 1967], No. 17256/68. Heading H1R. [Also in Division C7] In the electroless deposition of a metal, e.g. copper, on an insulating substrate for e.g. printed circuits, a finely divided active filler is incorporated into the starting material for the substrate, and the filler is able to combine chemically with a metal which initiates the deposition. The deposited metal is subsequently masked with a lacquer, thickened electrolytically with e.g. Cu, Ag or Au, the mask removed, and the surface etched until the exposed electroless coating is completely removed. The substrate may be phenol, epoxide, resol or cresol resin which may be applied to paper, glass fibre, synthetic or blended fibre cloths. The filler may be oxides of metals or metalloids, e.g. alumina, silicates of alkali metals, alkaline earth metals or alumino silicates, carbonates, and carbon black. The prepared substrate may be subjected to a chromo-sulphuric acid or sodium hydroxide bath, before activating in an ammoniacal noble metal salt or copper sulphate solution. The substrate is treated with a reducing agent, e.g. formaldehyde, sodium, borohydride, hydrazine or hydroxylamine either prior to or in the metallizing bath.