SPHERICAL SILICA PARTICLES, AND RESIN COMPOSITION USING SAME

    公开(公告)号:US20240417545A1

    公开(公告)日:2024-12-19

    申请号:US18701790

    申请日:2022-10-07

    Abstract: Provided are spherical silica particles that can achieve a lower dielectric dissipation factor when used to fill a resin, and a resin composition using the same.
    Spherical silica particles (X) are those having a surface fractal dimension of 1.0-2.3. The resin composition contains the spherical silica particles (X) and at least one resin selected from a thermoplastic resin and a thermosetting resin. The specific surface area of the spherical silica particles (X) is preferably 0.1-2.0 m2/g. The average particle diameter of the spherical silica particles (X) is preferably 1-30 μm.

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