公开(公告)号：US11849566B2

公开(公告)日：2023-12-19

申请号：US17509242

申请日：2021-10-25

Applicant: DENSO CORPORATION

Inventor： Toshihiro Miyake ,  Tadatomo Suga ,  Eiji Higurashi

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/00 ,  H01L23/373

CPC classification number: H05K7/20472 ,  H01L23/3735 ,  H05K1/0204 ,  H05K3/0061

Abstract: A joint structure includes a first member, a second member and a metal joint layer. The first member has including a first surface and is made of material having one of copper, copper alloy, aluminum, or aluminum alloy. The second member includes a second surface that faces the first surface of the first material. The metal joint layer includes a gold joint layer made of material having gold or gold alloy and is disposed between the first surface of the first material and the second surface of the second material. A thickness of the metal joint layer is smaller than flatness of the first surface of the first material and flatness of the second surface of the second material. Fluorine is dispersed inside at least the gold joint layer included in the metal joint layer.