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    Self-adjustable heat spreader system for set-top box assemblies
    4.
    发明授权
    Self-adjustable heat spreader system for set-top box assemblies 有权

    公开(公告)号：US10681844B2

    公开(公告)日：2020-06-09

    申请号：US16386065

    申请日：2019-04-16

    Applicant: DISH Technologies L.L.C.

    Inventor： Svitlana Trygubova ,  Morgan Kirby

    IPC: H05K7/20 ,  H05K1/02

    Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.

    SELF-ADJUSTABLE HEAT SPREADER SYSTEM FOR SET-TOP BOX ASSEMBLIES
    5.
    发明申请
    SELF-ADJUSTABLE HEAT SPREADER SYSTEM FOR SET-TOP BOX ASSEMBLIES 审中-公开

    公开(公告)号：US20190246522A1

    公开(公告)日：2019-08-08

    申请号：US16386065

    申请日：2019-04-16

    Applicant: DISH Technologies L.L.C.

    Inventor： Svitlana Trygubova ,  Morgan Kirby

    IPC: H05K7/20 ,  H05K1/02

    Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.

    Self-adjustable heat spreader system for set-top box assemblies
    7.
    发明授权
    Self-adjustable heat spreader system for set-top box assemblies 有权

    公开(公告)号：US10356948B2

    公开(公告)日：2019-07-16

    申请号：US14986065

    申请日：2015-12-31

    Applicant: DISH Technologies L.L.C.

    Inventor： Svitlana Trygubova ,  Morgan Kirby

    IPC: H05K7/20 ,  H05K1/02

    Abstract: Systems, electronic devices, and methods are directed to a self-adjustable heat spreader. A spring system may include one or more spring members and a contact surface adapted to contact a circuit board component. Each spring member may include a thermally conductive material. A thermal spreader plate may be coupled to the one or more spring members. The spring system and the thermal spreader plate may be configured to allow movement, with respect to the thermal spreader plate along multiple axes, of one or more portions of the one or more spring members proximate to the thermal spreader plate when the contact surface is pressed against the circuit board component and the spring system transitions from a first state to a compressed state. The contact surface and the spring system may be configured to transfer heat between the circuit board component and the thermal spreader plate.

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