公开(公告)号：US10426042B2

公开(公告)日：2019-09-24

申请号：US15905063

申请日：2018-02-26

Applicant: DISH Technologies L.L.C.

Inventor： Andros X Thomson, Jr. ,  Yt Ho

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11 ,  H05K3/00

Abstract: An approach for through-hole component soldering for a PCB, and a resulting PCB assembly, that eliminates protruding solder joints, is provided. The approach comprises back-drilling, from a bottom surface of a PCB, one or more through-holes, wherein each back-drilled through-hole is back-drilled to a depth partially through the PCB and at a diameter that is larger than the diameter of the through hole. Solder paste is applied to the PCB. The components are placed on the PCB, inserting each pin into a corresponding through-hole. The PCB is passed through a solder process, whereby, within each through-hole having a component pin inserted therein, the solder paste is wicked into the through-hole, and forms a solder joint with the respective pin. Each solder joint of a back-drilled through-hole is situated within the through-hole in a manner whereby the solder joint does not protrude beyond the bottom surface of the PCB.