公开(公告)号：CA3143801A1

公开(公告)日：2021-01-07

申请号：CA3143801

申请日：2019-07-01

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： MIAO WENKE ,  HE CHAO ,  XU XIANMIN ,  ESSEGHIR MOHAMED ,  MIAO XIAOXIONG

IPC: C08L23/06 ,  C08K7/22

Abstract: A cable includes (a) a conductor; and (b) an expanded polymeric coating surrounding at least a portion of the conductor, the expanded polymeric coating including: (i) 70.0 wt. % to 99.8 wt. % low-density polyethylene homopolymer; and (ii) 0.2 wt. % to 5.0 wt.% of expanded polymeric microspheres having a D50 average diameter of from 25 µm to 40 µm, wherein the expanded polymeric coating has a density of 0.75 g/cc or less.

公开(公告)号：CA3029340A1

公开(公告)日：2018-01-04

申请号：CA3029340

申请日：2016-06-30

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： SONG XIAOMEI ,  CHEN HONGYU ,  SUN YABIN ,  WU YOUJUN ,  LI WEI ,  MIAO XIAOXIONG

IPC: C08L23/04 ,  C08K3/04

Abstract: Semiconductive shield layers for power cable constructions are made from a composition comprising: (A) A nonpolar, ethylene-based polymer having a density of greater than (>) 0.90 g/cc and a melt index of >20 g/10 min at 190?/2.16 Kg; (B) A polar polymer consisting of ethylene and an unsaturated alkyl ester having 4 to 20 carbon atoms; (C) Acetylene carbon black; and (D) A curing agent; with the provisos that (1) the composition has a phase separated structure, and (2) the weight ratio of nonpolar polymer to polar polymer is from 0.25 to 4.

公开(公告)号：BR112021026461A2

公开(公告)日：2022-02-08

申请号：BR112021026461

申请日：2019-07-01

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： HE CHAO ,  ESSEGHIR MOHAMED ,  MIAO WENKE ,  XU XIANMIN ,  MIAO XIAOXIONG

IPC: C08K7/22 ,  C08L23/06

Abstract: cabo, e, composição de lote principal. a presente invenção se refere a um cabo que inclui (a) um condutor; e (b) um revestimento polimérico expandido que envolve pelo menos uma porção do condutor, em que o revestimento polimérico expandido inclui: (i) de 70,0% em peso a 99,8% em peso de homopolímero de polietileno de baixa densidade; e (ii) de 0,2% em peso a 5,0% em peso de microesferas poliméricas expandidas que têm um diâmetro médio d50 de 25 µm a 40 µm, em que o revestimento polimérico expandido tem uma densidade de 0,75 g/cm³ ou menos.