公开(公告)号：US20150357074A1

公开(公告)日：2015-12-10

申请号：US14762479

申请日：2014-02-10

Applicant: DOWA METALTECH CO., LTD.

Inventor： Takashi KIMURA ,  Toshiya KAMADA ,  Weilin GAO ,  Fumiaki SASAKI ,  Akira SUGAWARA

IPC: H01B1/02 ,  C22C9/06 ,  C22F1/08

CPC classification number: H01B1/026 ,  C22C9/06 ,  C22F1/08

Abstract: A copper alloy sheet material comprises (by mass %) from 2.50 to 4.00% in total of Ni and Co, from 0.50 to 2.00% of Co, from 0.70 to 1.50% of Si, from 0 to 0.50% of Fe, from 0 to 0.10% of Mg, from 0 to 0.50% of Sn, from 0 to 0.15% of Zn, from 0 to 0.07% of B, from 0 to 0.10% of P, from 0 to 0.10% of REM, from 0 to 0.01% in total of Cr, Zr, Hf, Nb and S, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles (particle diameter of 5 mm or more) is 10 per mm2 or less. A number density of fine secondary phase particles (particle diameter of from 5 to 10 nm) is 1.0·109 per mm2 or more. A Si concentration in the parent phase is 0.10% by mass or more.

Abstract translation: 铜合金板材包含Ni和Co总计为2.50〜4.00％（Co:0.50〜2.00％），0.70〜1.50％的Si，0〜0.50％的Fe，0〜 0〜0.50％的Sn，0〜0.15％的Zn，0〜0.07％的B，0〜0.10％的P，0〜0.10％的REM，0〜0.01％ 总共有Cr，Zr，Hf，Nb和S，余量为Cu和不可避免的杂质。 粗二次粒子的数密度（粒径为5mm以上）为10个/ mm 2以下。 细小二次相颗粒（粒径为5〜10nm）的数密度为1.0×109 / mm 2以上。 母相中的Si浓度为0.10质量％以上。

公开(公告)号：US20140116583A1

公开(公告)日：2014-05-01

申请号：US14068256

申请日：2013-10-31

Applicant: DOWA METALTECH CO., LTD.

Inventor： Toshiya KAMADA ,  Takashi KIMURA ,  Weilin GAO ,  Fumiaki SASAKI ,  Akira SUGAWARA

IPC: H01B1/02 ,  C22F1/08

CPC classification number: H01B1/026 ,  C21D2201/05 ,  C21D2211/004 ,  C22C9/06 ,  C22F1/08

Abstract: A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}≧3.0  (1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.

Abstract translation: Cu-Ni-Co-Si系铜合金板材具有存在于基体中的第二相粒子，超细二次粒子的数量密度为1.0×10 9个/ mm 2以上。 细密度的第二相颗粒的密度不超过5.0×10 7个/ mm 2。 粗二次粒子的数密度为1.0×10 5个/ mm 2以上且1.0×10 6个/ mm 2以下。 该材料具有满足以下等式（1）的晶体取向：I {200} / I0 {200}≥3.0（1）其中I {200}表示{200}晶面的X射线衍射峰的积分强度 在片材表面上; I0 {200}表示纯铜标准粉末样品中{200}晶面的X射线衍射峰的积分强度。