公开(公告)号：DE844920T1

公开(公告)日：2001-04-05

申请号：DE96928033

申请日：1996-08-02

Applicant: DYNETICS CORP

Inventor： PERRY WINFIELD

IPC: B24B9/00 ,  B24B31/00 ,  B24B31/116 ,  B24B49/02 ,  C09K3/14 ,  F02M61/16 ,  F02M61/18

Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.