公开(公告)号：JP2004284014A

公开(公告)日：2004-10-14

申请号：JP2004205797

申请日：2004-07-13

Applicant: Dynetics Corp ,  ダイネティックス・コーポレーション

Inventor： PERRY WINFIELD B ,  O'SHEA LIAM ,  WRIGHT MARK

IPC: B24B1/00 ,  B23Q39/04 ,  B24B3/16 ,  B24B31/00 ,  B24C3/32

CPC classification number: B24C3/20 ,  B23Q39/044 ,  B24B31/116 ,  B24C1/083 ,  B24C3/325 ,  B24C3/327

Abstract: PROBLEM TO BE SOLVED: To smooth and round micropores of a workpiece for calibration. SOLUTION: The workpiece is held on a positionable rotation rack 28. The rotation rack 28 passes a series of a calibration station, a polishing station and a washing station to move the workpiece. In the polishing station, a liquid polishing agent having flowability is made to flow into the micropores for a time based on a correlation relation having a statistical meaning in relation to an increase in calibration fluid flow rate. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：平滑和圆形的工件微孔用于校准。

解决方案：工件被保持在可定位的旋转架28上。旋转齿条28通过一系列校准台，抛光台和洗涤台以移动工件。 在研磨台中，使具有流动性的液体研磨剂基于与校正液流量的增加相关的具有统计意义的相关关系而流入微孔一段时间。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：EP0844920A4

公开(公告)日：2001-01-24

申请号：EP96928033

申请日：1996-08-02

Applicant: DYNETICS CORP

Inventor： PERRY WINFIELD B

IPC: B24B9/00 ,  B24B31/00 ,  B24B31/116 ,  B24B49/02 ,  C09K3/14 ,  F02M61/16 ,  F02M61/18

CPC classification number: F02M61/1846 ,  B24B31/116 ,  B24B49/02 ,  C09K3/1472 ,  F02M61/168 ,  F02M61/1806 ,  F02M61/1833

Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.

Abstract translation: 用于抛光和倒圆角微细孔的研磨液浆包括：一种液体介质; 细碎的磨料颗粒，worin浆料在做了磨料颗粒保持均匀分布的。当浆料不经受剪切，并且该浆料的粘度降低当经受剪切流过在0.69的压力的微孔以13.79兆帕为特征的; 和流变添加剂，以保持所述颗粒的分布。

公开(公告)号：AT237430T

公开(公告)日：2003-05-15

申请号：AT96928033

申请日：1996-08-02

Applicant: DYNETICS CORP

Inventor： PERRY WINFIELD B

IPC: B24B9/00 ,  B24B31/00 ,  B24B31/116 ,  B24B49/02 ,  C09K3/14 ,  F02M61/16 ,  F02M61/18

Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.

公开(公告)号：AU6764296A

公开(公告)日：1997-03-05

申请号：AU6764296

申请日：1996-08-02

Applicant: DYNETICS CORP

Inventor： PERRY WINFIELD B

IPC: B24B9/00 ,  B24B31/00 ,  B24B31/116 ,  B24B49/02 ,  C09K3/14 ,  F02M61/16 ,  F02M61/18

Abstract: An abrasive liquid slurry for polishing and radiusing microholes comprises: a liquid medium; finely divided abrasive particles, wherein the slurry is characterized in that the abrasive particles remain uniformly distributed when the slurry is not subjected to shear, and the slurry decreases in viscosity when subjected to shear flowing through a microhole at a pressure of 0.69 to 13.79 Mpa; and a rheological additive to maintain distribution of said particles.