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    CONNECTOR ASSEMBLY WITH INTEGRATED PITCH TRANSLATION
    2.
    发明申请
    CONNECTOR ASSEMBLY WITH INTEGRATED PITCH TRANSLATION 有权
    连接器总成与集成式翻译

    公开(公告)号：US20140273555A1

    公开(公告)日：2014-09-18

    申请号：US13826998

    申请日：2013-03-14

    Applicant: Gaurav Chawla ,  Rajasekaran Raja Swaminathan ,  Donald T. Tran

    Inventor： Gaurav Chawla ,  Rajasekaran Raja Swaminathan ,  Donald T. Tran

    IPC: H01R12/71

    CPC classification number: H01R12/71 ,  H01R12/53 ,  H01R12/57 ,  H01R25/006

    Abstract: This disclosure relates generally to a connector assembly. Optionally, first conductive members form a first row. Second conductive members include a first subset forming a second row and a second subset forming a third row, the second and third rows being parallel and offset with respect to one another. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding contact. At least one of the first and second subsets has a vertical displacement to form a common row of the second conductive members at a second end of the second conductive members. Individual ones of the first conductive members are arranged to be coupled proximate a second end of the first conductive members to the second end of a corresponding one of the second conductive members.

    Abstract translation: 本公开总体上涉及连接器组件。 可选地，第一导电构件形成第一行。 第二导电构件包括形成第二行的第一子集和形成第三行的第二子集，第二和第三行相对于彼此平行和偏移。 第一和第二导电构件中的各个被布置成在第一端耦合到相应的触点。 第一和第二子集中的至少一个具有垂直位移，以在第二导电构件的第二端处形成第二导电构件的公共排。 第一导电构件中的各个被布置成在第一导电构件的第二端附近耦合到相应的一个第二导电构件的第二端。

    Socket that engages a pin grid array
    3.
    发明授权
    Socket that engages a pin grid array 失效
    插座引脚格栅阵列

    公开(公告)号：US07670167B2

    公开(公告)日：2010-03-02

    申请号：US11972047

    申请日：2008-01-10

    Applicant: Vinayak Pandey ,  Mingji Wang ,  Donald T. Tran

    Inventor： Vinayak Pandey ,  Mingji Wang ,  Donald T. Tran

    IPC: H01R4/50

    CPC classification number: H01R13/112 ,  H01R12/716 ,  H05K7/1084

    Abstract: An example socket includes a plurality of contacts and a base. The base includes exterior walls and interior walls which extend between the exterior walls to form openings within the base such that each opening in the base includes one of the contacts. At least some interior walls include indentations that are adapted to receive projections on the contacts such that when the projections on the contacts are positioned within indentations in the interior walls, the contacts are secured to the base. Another example socket includes a first group of the interior walls that is oriented in a first direction and a second group of the interior walls oriented in a second direction that is orthogonal to the first direction. The first and second groups of interior walls form openings within the base with the first group of interior walls being higher than the second group of interior walls.

    Abstract translation: 示例性插座包括多个触点和底座。 底座包括在外壁之间延伸的外壁和内壁，以在基座内形成开口，使得底座中的每个开口都包括一个触点。 至少一些内壁包括适于接收触点上的突起的凹陷，使得当触点上的突起位于内壁中的凹陷中时，触头固定到基部。 另一示例性插座包括沿第一方向定向的第一组内壁和沿与第一方向正交的第二方向定向的第二组内壁。 第一和第二组内壁在基座内形成开口，第一组内壁高于第二组内壁。

    High-power double throw lever zip socket
    4.
    发明授权
    High-power double throw lever zip socket 失效
    大功率双掷拉杆拉链插座

    公开(公告)号：US06972213B2

    公开(公告)日：2005-12-06

    申请号：US10842772

    申请日：2004-05-11

    Applicant: Donald T. Tran

    Inventor： Donald T. Tran

    IPC: H05K7/10 ,  H01L21/50

    CPC classification number: H05K7/1007 ,  Y10T29/41

    Abstract: A system for providing electrical contacts between a die and an electrical device includes a package having a first major surface, a second major surface, a first scalloped edge, a second scalloped edge, and a solid end adapted for insertion into a slot. The solid end for carries power to the die or input/output signals. The scalloped edges also carry power. The package includes a plurality of electrical pins which carry input/output signals as well as power. The socket of the system includes a base having an opening therein adapted to receive the package. A cover with openings for receiving the pins covers the base. A power contact unit includes a pair of scalloped edges and a slot. The power contact unit and the cover moves with respect to the base of the socket.

    Abstract translation: 用于在管芯和电气器件之间提供电接触的系统包括具有第一主表面，第二主表面，第一扇形边缘，第二扇形边缘和适于插入槽中的实心端部的封装。 用于承载电源或输入/输出信号的实心端。 扇形边缘还带有电源。 该封装包括承载输入/输出信号以及电力的多个电引脚。 系统的插座包括其中具有适于接收包装的开口的底座。 具有用于接收销的开口的盖覆盖基座。 电源接触单元包括一对扇形边缘和一个槽。 动力接触单元和盖相对于插座的底座移动。

    Socket that engages a pin grid array
    5.
    发明授权
    Socket that engages a pin grid array 有权
    插座引脚格栅阵列

    公开(公告)号：US07361044B1

    公开(公告)日：2008-04-22

    申请号：US11610635

    申请日：2006-12-14

    Applicant: Vinayak Pandey ,  Mingji Wang ,  Donald T. Tran

    Inventor： Vinayak Pandey ,  Mingji Wang ,  Donald T. Tran

    IPC: H01R4/50

    CPC classification number: H01R13/112 ,  H01R12/716 ,  H05K7/1084

    Abstract: An example socket includes a plurality of contacts and a base. The base includes exterior walls and interior walls which extend between the exterior walls to form openings within the base such that each opening in the base includes one of the contacts. At least some interior walls include indentations that are adapted to receive projections on the contacts such that when the projections on the contacts are positioned within indentations in the interior walls, the contacts are secured to the base. Another example socket includes a first group of the interior walls that is oriented in a first direction and a second group of the interior walls oriented in a second direction that is orthogonal to the first direction. The first and second groups of interior walls form openings within the base with the first group of interior walls being higher than the second group of interior walls.

    Abstract translation: 示例性插座包括多个触点和底座。 底座包括在外壁之间延伸的外壁和内壁，以在基座内形成开口，使得底座中的每个开口都包括一个触点。 至少一些内壁包括适于接收触点上的突起的凹陷，使得当触点上的突起位于内壁中的凹陷中时，触头固定到基部。 另一示例性插座包括沿第一方向定向的第一组内壁和沿与第一方向正交的第二方向定向的第二组内壁。 第一和第二组内壁在基座内形成开口，第一组内壁高于第二组内壁。

    Electronic assembly with integrated IO and power contacts
    6.
    发明授权
    Electronic assembly with integrated IO and power contacts 有权
    具有集成IO和电源触点的电子组件

    公开(公告)号：US07344918B2

    公开(公告)日：2008-03-18

    申请号：US11384964

    申请日：2006-03-20

    Applicant: Donald T. Tran

    Inventor： Donald T. Tran

    IPC: H01L23/02

    CPC classification number: H01L23/50 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/183 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10409 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00

    Abstract: In some example embodiments, an integrated circuit, electronic assembly and method provide a current path for supplying power to a processor. As an example, the integrated circuit includes a base having power contacts that extend from an upper surface of base. The integrated circuit further includes a substrate that is mounted to the upper surface of the base to electrically couple the substrate to the base. A die is mounted on a substrate such that the die is electrically coupled to the substrate. The power contacts on the upper surface of the base engage a daughterboard so that the die is able to receive power from a voltage source mounted on the daughterboard through the power contacts on the upper surface of the base.

    Abstract translation: 在一些示例性实施例中，集成电路，电子组件和方法提供用于向处理器供电的电流路径。 作为示例，集成电路包括具有从基座的上表面延伸的电力触点的基座。 集成电路还包括安装到基座的上表面以将基板电耦合到基座的基板。 模具安装在基板上，使得模具电耦合到基板。 基座上表面上的电源触点接合子板，使得管芯能够通过基座上表面上的电源触点从安装在子板上的电压源接收电力。

    High-power double throw lever zip socket
    7.
    发明授权
    High-power double throw lever zip socket 有权
    大功率双掷拉杆拉链插座

    公开(公告)号：US06734548B1

    公开(公告)日：2004-05-11

    申请号：US10300331

    申请日：2002-11-20

    Applicant: Donald T. Tran

    Inventor： Donald T. Tran

    IPC: H01L2302

    CPC classification number: H05K7/1007 ,  Y10T29/41

    Abstract: A system for providing electrical contacts between a die and an electrical device includes a package having a first major surface, a second major surface, a first scalloped edge, a second scalloped edge, and a solid end adapted for insertion into a slot. The solid end for carries power to the die or input/output signals. The scalloped edges also carry power. The package includes a plurality of electrical pins which carry input/output signals as well as power. The socket of the system includes a base having an opening therein adapted to receive the package. A cover with openings for receiving the pins covers the base. A power contact unit includes a pair of scalloped edges and a slot. The power contact unit and the cover moves with respect to the base of the socket.

    Abstract translation: 用于在管芯和电气器件之间提供电接触的系统包括具有第一主表面，第二主表面，第一扇形边缘，第二扇形边缘和适于插入槽中的实心端的封装。 用于承载电源或输入/输出信号的实心端。 扇形边缘还带有电源。 该封装包括承载输入/输出信号以及电力的多个电引脚。 系统的插座包括其中具有适于接收包装的开口的底座。 具有用于接收销的开口的盖覆盖基座。 电源接触单元包括一对扇形边缘和一个槽。 动力接触单元和盖相对于插座的底座移动。

    INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR
    8.
    发明申请
    INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR 有权
    带有指尖连接器的互连电缆

    公开(公告)号：US20140322932A1

    公开(公告)日：2014-10-30

    申请号：US13870938

    申请日：2013-04-25

    Applicant: Donald T. Tran ,  Rajasekaran Swaminathan

    Inventor： Donald T. Tran ,  Rajasekaran Swaminathan

    IPC: H01R13/627 ,  H01R13/652 ,  H01R4/48

    CPC classification number: H01R12/721 ,  H01R12/714 ,  H01R12/81 ,  H01R13/6581 ,  H01R13/6592 ,  H01R43/205 ,  Y10T29/49174 ,  Y10T29/49176

    Abstract: Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.

    Abstract translation: 本公开的实施例涉及包括边缘指状连接器以及相关联的配置和方法的互连电缆。 边缘指状连接器可以设置在互连电缆的第一端处，并且可以将互连电缆连接到包括在封装衬底中或耦合到封装衬底的边缘指状物。 封装衬底可以包括在处理器封装组件中，并且处理器可以安装在衬底上。 互连电缆可以包括一个或多个细长导体，其中触点直接耦合到相应的导体。 第二连接器可以设置在互连电缆的第二端处，并且可以将互连电缆耦合到被配置为将互连电缆连接到SFP电缆的小型可插拔（SFP）壳体。 可以描述和要求保护其他实施例。

    High-power LGA socket
    10.
    发明授权
    High-power LGA socket 有权
    大功率LGA插座

    公开(公告)号：US07402182B2

    公开(公告)日：2008-07-22

    申请号：US11085289

    申请日：2005-03-21

    Applicant: Donald T. Tran

    Inventor： Donald T. Tran

    IPC: H01L21/00

    CPC classification number: H01L23/50 ,  H01L23/49805 ,  H01L2924/0002 ,  Y10T29/41 ,  H01L2924/00

    Abstract: A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion into a slot. The solid end and the scalloped edges carry current greater than the current needed for an input/output signal. The socket includes a base having an opening therein adapted to receive the package. A slot is located at one end of the opening in the base. The slot is provided with a plurality of conductors for carrying currents greater than the current needed for an input/output signal. A first edge and second edge of the opening include a plurality of spaced overhangs positioned over the opening. The overhangs are sloped with respect to the major planar surface.

    Abstract translation: 用于在管芯和电气器件之间提供电接触的系统包括管芯和封装。 该包装包括第一主表面，第二主表面，第一扇形边缘，第二扇形边缘和适于插入槽中的实心端。 实心端和扇形边沿的电流大于输入/输出信号所需的电流。 插座包括其中具有适于接收封装的开口的基座。 槽位于底座开口的一端。 该槽设置有多个导体，用于承载大于输入/输出信号所需电流的电流。 开口的第一边缘和第二边缘包括位于开口上方的多个间隔开的突出部分。 突出部分相对于主平面倾斜。

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