公开(公告)号：US20150287617A1

公开(公告)日：2015-10-08

申请号：US14747288

申请日：2015-06-23

Applicant: EBARA CORPORATION

Inventor： Xinming WANG ,  Fumitoshi OIKAWA ,  Haruko ONO ,  Teruaki HOMBO

IPC: H01L21/67 ,  B08B1/04

CPC classification number: H01L21/67046 ,  B08B1/04

Abstract: A substrate is cleaned by performing a scrubbing process on a surface to be cleaned of the rotating substrate with a roll-shaped cleaning member while holding an outer circumferential surface of the roll-shaped cleaning member in contact with the surface to be cleaned of the substrate across a predetermined contact width. During at least a part of the scrubbing process, the roll-shaped cleaning member is placed at an offset cleaning position where the central axis of the roll-shaped cleaning member is spaced from the central axis of the substrate by a distance which is 0.14 to 0.5 times the contact width. The surface to be cleaned of the substrate is scrubbed with more uniform cleaning intensity while taking into account the cleaning intensity at each position (area) along the radial direction of the surface to be cleaned of the substrate.

Abstract translation: 通过在保持辊状清洁部件的外周面与基板的待清洗表面接触的同时用辊状清洁部件在旋转基板的待清洁表面上进行擦洗处理来清洁基板 跨越预定的接触宽度。 在洗涤过程的至少一部分期间，辊状清洁部件被放置在偏移清洁位置，其中辊状清洁部件的中心轴线与基板的中心轴线间隔开0.14至 接触宽度的0.5倍。 要清洁基材的表面，在考虑到沿基材待清洁表面的径向的每个位置（区域）处的清洁强度时，以更均匀的清洁强度进行擦洗。