公开(公告)号：US20250041987A1

公开(公告)日：2025-02-06

申请号：US18785044

申请日：2024-07-26

Applicant: EBARA CORPORATION

Inventor： Masaki KINOSHITA ,  Yoichi SHIOKAWA ,  Keita TANOUE

IPC: B24B37/013

Abstract: A polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; an optical film-thickness measuring system having an optical sensor head mounted to the polishing table; a transparent-liquid inlet passage configured to supply a transparent liquid to the through-hole; and a light-emitting-side transparent-liquid outlet passage and a light-receiving-side transparent-liquid outlet passage communicating with the through-hole. The optical sensor head has a light-emitting surface configured to emit light obliquely upward and a light-receiving surface configured to receive reflected light from the workpiece, and the light-emitting surface faces the light-emitting-side transparent-liquid outlet passage, and the light-receiving surface faces the light-receiving-side transparent-liquid outlet passage.

公开(公告)号：US20240278378A1

公开(公告)日：2024-08-22

申请号：US18544073

申请日：2023-12-18

Applicant: EBARA CORPORATION

Inventor： Yoichi SHIOKAWA ,  Masaki KINOSHITA ,  Yuki WATANABE ,  Toshifumi KIMBA ,  Keita TANOUE

IPC: B24B37/005 ,  B24B37/20

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: A polishing apparatus that can improve an accuracy of position coordinates associated with a measured value of film thickness is disclosed. The polishing apparatus includes: a pad-thickness measuring device configured to measure a thickness of the polishing pad; an optical film-thickness measuring device configured to emit light obliquely to the substrate, and determine measured values of film thickness at measurement points; and a controller configured to associates the measured values of the film thickness with measurement coordinates indicating positions of the measurement points. The controller is configured to determine amount of movement of the measurement coordinates corresponding to a measured value of the thickness of the polishing pad based on correlation data indicating a relationship between the thickness of the polishing pad and the amount of movement of the measurement coordinates; and correct the measurement coordinates associated with the measured values of the film thickness based on the determined amount of movement of the measurement coordinates.