SUBSTRATE PROCESSING APPARATUS
    1.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 有权
    基板加工设备

    公开(公告)号:US20150290767A1

    公开(公告)日:2015-10-15

    申请号:US14682774

    申请日:2015-04-09

    Abstract: A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to the polishing section or the cleaning section to which the test mode is set.

    Abstract translation: CMP装置包括抛光单元3,清洁单元4,装载/卸载单元2,传送单元和被配置为控制传送单元中的基板的传送的控制部5。 当抛光单元包括多个抛光部分时,或者清洁单元包括多个清洁部分时,控制部分5可以设置操作抛光部分或清洁部分的测试模式以进行一些多次抛光 部分或多个清洁部分中的一些使得将基板转移到未设置测试模式的抛光部分或清洁部分,并且使得与基板相对于抛光部分的不同的测试基板或清洁 测试模式设置的部分。

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