公开(公告)号：US20240286245A1

公开(公告)日：2024-08-29

申请号：US18584763

申请日：2024-02-22

Applicant: EBARA CORPORATION

Inventor： Shinji KAJITA ,  Jyoji HEIANNA ,  Takayuki KAJIKAWA ,  Masamitsu AGARI

IPC: B24B37/34 ,  B05C5/02 ,  B08B3/02

CPC classification number: B24B37/34 ,  B05C5/0212 ,  B08B3/02

Abstract: A substrate treatment apparatus includes: a pretreatment unit that performs a hydrophilic process on a pre-polishing back surface of a substrate; and a polishing unit that polishes a front surface of the substrate having the back surface subjected to the hydrophilic process performed by the pretreatment unit.