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公开(公告)号:WO2021222020A1
公开(公告)日:2021-11-04
申请号:PCT/US2021/028845
申请日:2021-04-23
Applicant: ELBIT SYSTEMS OF AMERICA, LLC
Inventor: CHILCOTT, Dan W. , SMITH, Arlynn W.
Abstract: The present disclosure relates to hermetic sealing of a device within a package or assembly. The sealable device is preferably a MEMS device. Surrounding the device is a first seal member that defines an internal cavity. The device can be positioned within the internal cavity, the extents of which defines a first seal region. A second seal member, and possibly others, is preferably positioned outside of the first seal member. The second seal member surrounds the first seal member a spaced distance from the first seal member to define a second seal region. Getter material is preferably placed within the first and second seal regions, and the first and second seal regions are sealed under vacuum pressure to provide a MEMS packaged assembly having a relatively low leak rate.
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公开(公告)号:EP4143874A1
公开(公告)日:2023-03-08
申请号:EP21796680.3
申请日:2021-04-23
Applicant: Elbit Systems of America, LLC
Inventor: CHILCOTT, Dan W. , SMITH, Arlynn W.
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