公开(公告)号：WO2021222020A1

公开(公告)日：2021-11-04

申请号：PCT/US2021/028845

申请日：2021-04-23

Applicant: ELBIT SYSTEMS OF AMERICA, LLC

Inventor： CHILCOTT, Dan W. ,  SMITH, Arlynn W.

IPC: H01L23/02 ,  B32B7/12 ,  B32B9/04 ,  B32B17/06 ,  B32B37/18 ,  G02B23/12

Abstract: The present disclosure relates to hermetic sealing of a device within a package or assembly. The sealable device is preferably a MEMS device. Surrounding the device is a first seal member that defines an internal cavity. The device can be positioned within the internal cavity, the extents of which defines a first seal region. A second seal member, and possibly others, is preferably positioned outside of the first seal member. The second seal member surrounds the first seal member a spaced distance from the first seal member to define a second seal region. Getter material is preferably placed within the first and second seal regions, and the first and second seal regions are sealed under vacuum pressure to provide a MEMS packaged assembly having a relatively low leak rate.

公开(公告)号：EP4143874A1

公开(公告)日：2023-03-08

申请号：EP21796680.3

申请日：2021-04-23

Applicant: Elbit Systems of America, LLC

Inventor： CHILCOTT, Dan W. ,  SMITH, Arlynn W.

IPC: H01L23/02 ,  B32B7/12 ,  B32B9/04 ,  B32B17/06 ,  B32B37/18 ,  G02B23/12