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1.发明申请HIGH SPEED, CONTROLLED IMPEDANCE AIR DIELECTRIC ELECTRONIC BACKPLANE SYSTEMS 审中-公开高速，控制阻抗空气电子电子背板系统
公开(公告)号：WO03034636A8
公开(公告)日：2004-05-06
申请号：PCT/US0233495
申请日：2002-10-18
Applicant: ELCO RICHARD A
Inventor： ELCO RICHARD A , LEMKE TIMOTHY
CPC classification number: H05K1/024 , H01P3/08 , H05K1/14 , H05K3/10 , H05K3/202 , H05K2201/044 , H05K2201/09318
Abstract: The invention is a novel backplane interconnection system (5) that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10GHz and beyond. The invention provides high performance at a low cost of manufacture. It is suitable for use in a wide variety of system applications. One embodiment of the invention comprises an air dielectric and copper conductor matched impedance transmission line system (15) that interconnects daughter cards in a conventional backplane configuration. The high speed transmission-line structure is continuous through the backplane-daughter card and return path. Such embodiments are also integrated with conventional printed circuit backplanes or can be a stand-alone device.
Abstract translation: 本发明是一种新颖的背板互连系统（5），其在超高速背板系统的电信和数据处理工业中是有用的。 它能够传输10GHz及以上带宽的数字信号。 本发明以低成本制造提供高性能。 适用于各种系统应用。 本发明的一个实施例包括在常规背板配置中互连子卡的空气电介质和铜导体匹配阻抗传输线系统（15）。 高速传输线结构通过背板 - 子卡和返回路径是连续的。 这样的实施例也与常规印刷电路背板集成，或者可以是独立设备。
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2.发明申请HIGH SPEED, CONTROLLED IMPEDANCE AIR DIELECTRIC ELECTRONIC BACKPLANE SYSTEMS 审中-公开高速，受控阻抗空气介电电子背板系统
公开(公告)号：WO03034636A2
公开(公告)日：2003-04-24
申请号：PCT/US0233495
申请日：2002-10-18
Applicant: ELCO RICHARD A
Inventor： ELCO RICHARD A , LEMKE TIMOTHY
CPC classification number: H05K1/024 , H01P3/08 , H05K1/14 , H05K3/10 , H05K3/202 , H05K2201/044 , H05K2201/09318
Abstract: The invention is a novel backplane interconnection system (5) that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10GHz and beyond. The invention provides high performance at a low cost of manufacture. It is suitable for use in a wide variety of system applications. One embodiment of the invention comprises an air dielectric and copper conductor matched impedance transmission line system (15) that interconnects daughter cards in a conventional backplane configuration. The high speed transmission-line structure is continuous through the backplane-daughter card and return path. Such embodiments are also integrated with conventional printed circuit backplanes or can be a stand-alone device.
Abstract translation: 本发明是一种新颖的背板互连系统（5），其在用于超高速背板系统的电信和数据处理行业中是有用的。 它能够传输10GHz及以上带宽的数字信号。 本发明以低成本制造提供高性能。 它适用于各种系统应用。 本发明的一个实施例包括空气介质和铜导体匹配阻抗传输线路系统（15），其在常规背板配置中互连子卡。 高速传输线结构通过背板 - 子卡和返回路径连续。 这样的实施例也与传统的印刷电路背板集成或可以是独立的装置。
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公开(公告)号：AU2002362877A1
公开(公告)日：2003-04-28
申请号：AU2002362877
申请日：2002-10-18
Applicant: ELCO RICHARD A
Inventor： ELCO RICHARD A , LEMKE TIMOTHY
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