公开(公告)号：US20140077893A1

公开(公告)日：2014-03-20

申请号：US13706819

申请日：2012-12-06

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH IN

Inventor： Hong Yeol LEE ,  Man Seok UHM ,  So Hyeun YUN ,  Chang Soo KWAK ,  Jang Sup CHOI ,  In Bok YOM

IPC: H01P5/02

CPC classification number: H01P3/006 ,  C04B26/18 ,  C04B2111/56 ,  H03H7/38 ,  Y02W30/94 ,  C04B14/06 ,  C04B18/141 ,  C04B20/0096

Abstract: Disclosed is a substrate integrated waveguide coupler. The substrate integrated waveguide coupler according to the present invention includes: a substrate; an upper conducting plate applied to an upper portion of the substrate; a lower conducting plate applied to a lower portion of the substrate; two peripheral via holes disposed parallel to each other on both sides of the substrate, respectively, and being of a pipeline type electrically connecting the upper conducting plate and the lower conducting plate to each other; and an inner via hole disposed between the two peripheral via holes, and having a center thereof separated by a preset distance and forming a short slot functioning to couple input signals.

Abstract translation: 公开了一种基板集成波导耦合器。 根据本发明的衬底集成波导耦合器包括：衬底; 施加到所述基板的上部的上导电板; 施加到基板的下部的下导电板; 分别在基板的两侧彼此平行设置的两个外围通孔，并且是将上导电板和下导电板彼此电连接的管道型; 以及设置在两个周边通孔之间的内部通孔，并且其中心具有预定距离并形成用于耦合输入信号的短槽。