公开(公告)号：US3921888B1

公开(公告)日：1993-01-12

申请号：US53319974

申请日：1974-12-16

Applicant: ELECTROVERT LTD

Inventor： DONALD A ELLIOTT ,  ZOLTAN PALKO

IPC: B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K1/08 ,  B23K3/0653 ,  B23K2201/42 ,  H05K3/3468

Abstract: An apparatus applies solder to exposed and protruding metallic surfaces extending from one face of a printed circuit board being passed at a predetermined speed along a path having an upward slope. A solder reservoir has a discharge nozzle positioned thereabove to produce a solder wave, with the protruding pins or the like on each circuit board entering one side of this wave and exiting from the other side. The wave is so guided that a major volumetric portion thereof flows downwardly on the entry side of the wave and the remaining volumetric portion is guided to flow from the exit side of the wave along a tray leading to an adjustable weir. The solder flows along this tray either horizontally or downwardly, as a smooth stream of solder in substantially the same direction and at substantially the same speed as that of the circuit boards moving along the path. The circuit boards are withdrawn from the smooth stream of solder with a relative movement, between the protruding portions of the circuit boards and the smooth stream of solder, which is substantially only vertical so that "side icicles" of solder are avoided.