公开(公告)号：AU2014248049B2

公开(公告)日：2018-06-07

申请号：AU2014248049

申请日：2014-04-04

Applicant: EMERSON CLIMATE TECHNOLOGIES INC

Inventor： ALSALEEM FADI M ,  HEMMELGARN GREGG M

IPC: F25B30/06 ,  F25B27/00 ,  F25B49/02

Abstract: A heat-pump circuit may include an indoor heat exchanger, an outdoor heat exchanger, a compressor adapted to circulate a working fluid between the indoor and outdoor heat exchangers, and an expansion device disposed between the indoor and outdoor heat exchangers. A monitor for the heat-pump system may include a return-air temperature sensor, a supply-air temperature sensor, and a processor. The return-air temperature sensor may be adapted to measure a first air temperature of air upstream of the indoor heat exchanger. The supply-air temperature sensor may be adapted to measure a second air temperature of air downstream of the indoor heat exchanger. The processor may be in communication with the return-air temperature sensor and the supply- air temperature sensor. The processor may be programmed to determine a working-fluid-charge condition of the heat-pump system based on the first and second air temperatures.