公开(公告)号：US20010021473A1

公开(公告)日：2001-09-13

申请号：US09780500

申请日：2001-02-12

Applicant: EMTEC MAGNETICS GmbH

Inventor： Stephan Bauer ,  Bernd Bronstert ,  Uwe Burkhardt ,  Franz Weingart ,  Thomas Kessler ,  Helmut Mohwald ,  Florian Hennenberger

IPC: H01M002/16 ,  H01M004/62 ,  H01M004/58 ,  H01M006/18

CPC classification number: B32B27/18 ,  B29C48/00 ,  B29C48/08 ,  B29C48/288 ,  B29C48/2886 ,  B29C48/297 ,  B29K2105/06 ,  B29K2995/0005

Abstract: A molding, preferably a film-like molding, is produced by a process which comprises the following stage: I) Compounding and extruding the melt of a mixture I which comprises a mixture II which contains: a) from 1 to 95% by weight of at least one pigment III which has a primary particle size of from 5 nm to 20 nullm and is selected from the group consisting of an electrochemically inert solid IIIa, a compound IIIb capable of releasing lithium ions on charging and a compound IIIc capable of accepting lithium ions on charging and a mixture of the solid IIIa with the compound IIIb or the compound IIIc, b) from 5 to 99% by weight of at least one copolymer IV of vinylidene fluoride (VdF) and hexafluoropropylene (HFP) containing from 8 to 25% by weight of HFP and c) from 1 to 200% by weight, based on the total amount of the components a) and b), of a plasticizer V which is selected from the group consisting of dibutyl phthalate, dimethyl phthalate, diethyl phthalate, tris(butoxyethyl) phosphate, propylene carbonate, ethylene carbonate, trimethyl trimellitate and mixtures of two or more thereof, the proportion of the mixture II in the mixture I being from 1 to 100% by weight.

Abstract translation: 通过包括以下步骤的方法制备成型，优选膜状模制品：I）将包含混合物II的混合物I的熔体进行混合和挤出，所述混合物II包含：a）1至95重量％ 至少一种颜料III，其一次粒径为5nm至20μm，并且选自电化学惰性固体IIIa，能够在充电时释放锂离子的化合物IIIb和能够接受锂的化合物IIIc 充电时的离子和固体IIIa与化合物IIIb或化合物IIIc的混合物，b）5至99重量％的至少一种含有8至25个的偏二氟乙烯（VdF）和六氟丙烯（HFP）的共聚物IV 重量％的HFP和c）1至200重量％，基于组分a）和b）的组分的总量，所述增塑剂V选自邻苯二甲酸二丁酯，邻苯二甲酸二甲酯，邻苯二甲酸二乙酯 ，磷酸三（丁氧基乙基）酯 ，碳酸亚丙酯，碳酸亚乙酯，偏苯三甲酸三甲酯及其两种或多种的混合物，混合物I中混合物I的比例为1至100％（重量）。