公开(公告)号：US20230320617A1

公开(公告)日：2023-10-12

申请号：US18114544

申请日：2023-02-27

Applicant: ENDOTRONIX, INC.

Inventor： Mohammad Faisal Zaman ,  Jeffrey Fong ,  Julian Chee ,  Tyler Panian ,  Michael Nagy

IPC: A61B5/07 ,  A61B5/00 ,  A61B5/01 ,  A61B5/0215 ,  A61B5/03

CPC classification number: A61B5/076 ,  A61B5/0031 ,  A61B5/01 ,  A61B5/0215 ,  A61B5/036 ,  A61B5/6876 ,  A61B5/02152 ,  A61B2562/168 ,  A61B5/6869 ,  A61B5/08

Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.

公开(公告)号：US11896365B2

公开(公告)日：2024-02-13

申请号：US18114544

申请日：2023-02-27

Applicant: ENDOTRONIX, INC.

Inventor： Mohammad Faisal Zaman ,  Jeffrey Fong ,  Julian Chee ,  Tyler Panian ,  Michael Nagy

IPC: A61B5/07 ,  A61B5/00 ,  A61B5/01 ,  A61B5/0215 ,  A61B5/03 ,  A61B5/08

CPC classification number: A61B5/076 ,  A61B5/0031 ,  A61B5/01 ,  A61B5/0215 ,  A61B5/02152 ,  A61B5/036 ,  A61B5/6876 ,  A61B5/08 ,  A61B5/6869 ,  A61B2562/0247 ,  A61B2562/168

Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.

公开(公告)号：US11589773B2

公开(公告)日：2023-02-28

申请号：US16251146

申请日：2019-01-18

Applicant: ENDOTRONIX, INC.

Inventor： Mohammad Faisal Zaman ,  Jeffrey Fong ,  Julian Chee ,  Tyler Panian ,  Michael Nagy

IPC: A61B5/07 ,  A61B5/00 ,  A61B5/01 ,  A61B5/0215 ,  A61B5/03 ,  A61B5/08

Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.

公开(公告)号：US20240172957A1

公开(公告)日：2024-05-30

申请号：US18434054

申请日：2024-02-06

Applicant: ENDOTRONIX, INC.

Inventor： Mohammad Faisal Zaman ,  Jeffrey Fong ,  Julian Chee ,  Tyler Panian ,  Michael Nagy

IPC: A61B5/07 ,  A61B5/00 ,  A61B5/01 ,  A61B5/0215 ,  A61B5/03 ,  A61B5/08

CPC classification number: A61B5/076 ,  A61B5/0031 ,  A61B5/01 ,  A61B5/0215 ,  A61B5/02152 ,  A61B5/036 ,  A61B5/6876 ,  A61B5/08 ,  A61B5/6869 ,  A61B2562/0247 ,  A61B2562/168

Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.

公开(公告)号：US20190150785A1

公开(公告)日：2019-05-23

申请号：US16251146

申请日：2019-01-18

Applicant: ENDOTRONIX, INC.

Inventor： Mohammad Faisal Zaman ,  Jeffrey Fong ,  Julian Chee ,  Tyler Panian ,  Michael Nagy

IPC: A61B5/07 ,  A61B5/0215 ,  A61B5/145 ,  A61B5/03 ,  A61B5/00 ,  A61B5/01

Abstract: Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.