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公开(公告)号:US10535799B2
公开(公告)日:2020-01-14
申请号:US15971367
申请日:2018-05-04
Applicant: EPISTAR CORPORATION
Inventor: Tzu-Chieh Hsu , Yi-Wen Huang , Shou-Lung Chen , Hsin-Kang Chen
Abstract: A semiconductor device includes a first reflective structure, a second reflective structure and a cavity region between the first reflective structure and the second reflective structure. The cavity region includes a first surface and a second surface opposite to the first surface. The semiconductor device further includes a first electrode on the first surface and electrically connected to the first reflective structure. The semiconductor device further includes a second electrode on the first surface and electrically connected to the second reflective structure. The semiconductor device further includes a first conductive layer on the second surface of the cavity region and including a hole formed therethrough.
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公开(公告)号:US11024768B2
公开(公告)日:2021-06-01
申请号:US16709369
申请日:2019-12-10
Applicant: EPISTAR CORPORATION
Inventor: Tzu-Chieh Hsu , Yi-Wen Huang , Shou-Lung Chen , Hsin-Kang Chen
IPC: H01L33/10 , H01S5/02 , H01L33/60 , H01L33/20 , H01L33/62 , H01L33/38 , H01S5/42 , H01S5/042 , H01S5/183
Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor stack, a trench formed in the semiconductor stack, a current confinement layer, a first electrode and a second electrode. The semiconductor stack includes a first reflective structure, a second reflective structure, and a cavity region. The cavity is between the first reflective structure and the second reflective structure and has a first surface and a second surface opposite to the first surface. The current confinement layer is in the second reflective structure. The first electrode and the second electrode are on the first surface.
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公开(公告)号:US11699774B2
公开(公告)日:2023-07-11
申请号:US17333611
申请日:2021-05-28
Applicant: EPISTAR CORPORATION
Inventor: Tzu-Chieh Hsu , Yi-Wen Huang , Shou-Lung Chen , Hsin-Kang Chen
IPC: H01L33/10 , H01S5/42 , H01L33/60 , H01L33/20 , H01L33/62 , H01L33/38 , H01S5/02 , H01S5/042 , H01S5/183
CPC classification number: H01L33/10 , H01L33/20 , H01L33/385 , H01L33/60 , H01L33/62 , H01S5/0216 , H01S5/0425 , H01S5/04254 , H01S5/04256 , H01S5/423 , H01S5/0217 , H01S5/04257 , H01S5/18305 , H01S5/18311 , H01S2301/176
Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate having a first side and a second side opposite to the first side; a first optical element at the first side of the substrate; and a semiconductor stack on the substrate. The semiconductor stack includes a first reflective structure; a second reflective structure; a cavity region between the first reflective structure and the second reflective structure and having a first surface and a second surface opposite to the first surface; and a confinement layer in one of the second reflective structure and the first reflective structure. The semiconductor device further includes a first electrode and a second electrode on the first surface.
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公开(公告)号:US11251336B2
公开(公告)日:2022-02-15
申请号:US16725040
申请日:2019-12-23
Applicant: EPISTAR CORPORATION
Inventor: Hsin-Kang Chen , Jung-Jen Li
Abstract: A semiconductor device includes a semiconductor stack having a first-type semiconductor structure, an active structure, and a second-type semiconductor structure disposed on the first-type semiconductor structure. The second-type semiconductor structure has a doping concentration. A first portion includes a part of the first-type semiconductor structure, the active structure, and the second-type semiconductor structure, and has a current confining region. A second portion includes a part of the first-type semiconductor structure, the active structure, and the second-type semiconductor structure, and includes a first-type heavily doped region in the second-type semiconductor structure. The first-type heavily doped region includes a doping concentration higher than that of the second-type semiconductor structure.
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