Light-Emitting Element
    1.
    发明申请
    Light-Emitting Element 有权
    发光元件

    公开(公告)号:US20160172560A1

    公开(公告)日:2016-06-16

    申请号:US14948733

    申请日:2015-11-23

    Abstract: A light-emitting element includes: a semiconductor light-emitting stack including a first semiconductor layer with a first conductivity, an active layer, and a second semiconductor layer with a second conductivity; a first conductive layer disposed on the semiconductor light-emitting stack and electrically connecting the second semiconductor layer; a first insulating layer on the first conductive layer; a second conductive layer disposed on the first insulating layer and electrically connecting the first semiconductor layer; a second insulating layer on the second conductive layer; a first pad and a second pad on the second conductive layer; and a cushion part disposed between the first pad and the second pad.

    Abstract translation: 发光元件包括:包括具有第一导电性的第一半导体层,有源层和具有第二导电性的第二半导体层的半导体发光堆叠; 设置在所述半导体发光堆叠上并电连接所述第二半导体层的第一导电层; 在所述第一导电层上的第一绝缘层; 第二导电层,设置在所述第一绝缘层上并电连接所述第一半导体层; 在所述第二导电层上的第二绝缘层; 在第二导电层上的第一焊盘和第二焊盘; 以及设置在第一垫和第二垫之间的缓冲部。

    LIGHT-EMITTING ELEMENT
    3.
    发明申请

    公开(公告)号:US20210249565A1

    公开(公告)日:2021-08-12

    申请号:US17241958

    申请日:2021-04-27

    Abstract: A light-emitting element includes a semiconductor light-emitting stack including a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed therebetween; a first conductive layer disposed on the second semiconductor layer and electrically connecting the second semiconductor layer; a second conductive layer disposed on the second semiconductor layer and electrically connecting the first semiconductor layer; and a cushion part disposed on and directly contacts the first conductive layer, wherein in a top view, the cushion part is surrounded by and electrically isolated from the second conductive layer.

    LIGHT-EMITTING ELEMENT AND THE MANUFACTURING METHOD THEREOF
    4.
    发明申请
    LIGHT-EMITTING ELEMENT AND THE MANUFACTURING METHOD THEREOF 审中-公开
    发光元件及其制造方法

    公开(公告)号:US20160013363A1

    公开(公告)日:2016-01-14

    申请号:US14326270

    申请日:2014-07-08

    Abstract: A light-emitting element comprises: a light-emitting stack configured to emit light; and a transparent substrate comprising an upper surface on which the light-emitting stack is formed, a bottom surface opposite to the upper surface, and a side surface connecting the upper surface with the bottom surface, wherein the side surface comprises a first arc portion, a second arc portion, and a transition portion between the first arc portion from and second arc portion.

    Abstract translation: 发光元件包括:配置为发光的发光叠层; 以及透明基板,其包括形成有所述发光叠层的上表面,与所述上表面相对的底面,以及将所述上表面与所述底面连接的侧面,其中,所述侧面包括第一圆弧部, 第二弧形部分和在第一弧形部分和第二弧形部分之间的过渡部分。

    METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT
    6.
    发明申请
    METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT 审中-公开
    制造发光元件的方法

    公开(公告)号:US20160254409A1

    公开(公告)日:2016-09-01

    申请号:US15149837

    申请日:2016-05-09

    Abstract: A method for manufacturing a light-emitting element, including steps of: providing a wafer-level element including a wafer and a light-emitting stack on the wafer, wherein the wafer including an upper surface and a bottom surface, and light-emitting stack is formed on the upper surface of the wafer; forming a light-emitting stack on the upper surface of the wafer; cutting the wafer from one of the bottom surface or the top surface of the wafer by a water-jet laser having a first beam size; cutting the wafer from the other one of the bottom surface or the upper surface of the wafer by the water-jet laser having a second beam size; and dividing the wafer-level element wafer and the light-emitting stack into a plurality of light-emitting dies.

    Abstract translation: 一种制造发光元件的方法,包括以下步骤:在晶片上提供包括晶片和发光叠层的晶片级元件,其中包括上表面和底表面的晶片和发光叠层 形成在晶片的上表面上; 在晶片的上表面上形成发光叠层; 通过具有第一光束尺寸的喷水激光从晶片的底表面或顶表面中的一个切割晶片; 通过具有第二光束尺寸的喷水激光从晶片的底表面或上表面中的另一个切割晶片; 并将晶片级元件晶片和发光叠层分割成多个发光模具。

    LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF
    7.
    发明申请
    LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF 有权
    发光装置及其制造方法

    公开(公告)号:US20150060909A1

    公开(公告)日:2015-03-05

    申请号:US14013166

    申请日:2013-08-29

    CPC classification number: H01L33/38 H01L33/0095 H01L33/22 H01L33/42

    Abstract: A light-emitting device comprises: a first semiconductor layer; a transparent conductive oxide layer including a diffusion region having a first metal material and a non-diffusion region devoid of the first metal material, wherein the non-diffusion region is closer to the first semiconductor layer than the diffusion region; and a metal layer formed on the transparent conductive oxide layer, wherein the metal layer is pervious to a light emitted from the active layer and comprises a pattern.

    Abstract translation: 发光器件包括:第一半导体层; 透明导电氧化物层,其包括具有第一金属材料的扩散区域和不具有第一金属材料的非扩散区域,其中所述非扩散区域比所述扩散区域更靠近所述第一半导体层; 以及形成在所述透明导电氧化物层上的金属层,其中所述金属层可透过从所述有源层发射的光并且包括图案。

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