-
公开(公告)号：US20200328330A1
公开(公告)日：2020-10-15
申请号：US16846059
申请日：2020-04-10
Applicant: EPISTAR CORPORATION
Inventor： Tsung-Hong LU , Pao-Yu LIAO , Ching-Tai CHENG
Abstract: A LED package comprises an LED chip, a reflective structure which encloses the LED chip, a wavelength conversion structure placed on the LED chip, and an absorbing structure which encloses or is placed on the reflective structure.
Search Results
1
records
(took 0.053 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
