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    MODULAR ELECTRONICS CHASSIS
    1.
    发明申请
    MODULAR ELECTRONICS CHASSIS 审中-公开
    模块化电子机箱

    公开(公告)号：WO2014190192A3

    公开(公告)日：2015-06-04

    申请号：PCT/US2014039214

    申请日：2014-05-22

    Applicant: EXABLOX CORP

    Inventor： BROCKETT DOUGLAS

    IPC: H05K7/14

    CPC classification number: G06F1/187 ,  G06F1/181 ,  G11B33/128 ,  Y10T29/49826 ,  Y10T29/53274

    Abstract: An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis comprises a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, a first ejection actuator coupled to the door and configured to move simultaneously with the door, a second ejection actuator including a spring member connected to the second ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the second ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis comprises a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the second ejection actuator along the chassis enclosure.

    Abstract translation: 提供了一种用于从底盘移除模块化电子设备的装置及其组装方法。 用于从底盘移除模块化电子设备的装置包括可枢转地联接到底盘的门，与门滑动接合的滑动元件，联接到门并配置成与门同时移动的第一弹出致动器，第二弹出 致动器，包括连接到第二喷射致动器和底盘后部的弹簧部件，以及将滑动元件与第二喷射致动器连接的联动元件。 另外，用于从底盘移除模块化电子设备的装置包括设置在机箱外壳中的导轨，以引导模块化电子设备并沿着机箱外壳引导第二弹出致动器。

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