公开(公告)号：WO2021211778A1

公开(公告)日：2021-10-21

申请号：PCT/US2021/027378

申请日：2021-04-15

Applicant: EXCELITAS CANADA, INC. ,  EXCELITAS TECHNOLOGIES CORP.

Inventor： JU, Jin Han ,  CHARLEBOIS, Gabriel

IPC: H01S5/02208 ,  H01S5/02218 ,  H01S5/02345 ,  H01S5/40 ,  H01S5/02257 ,  H01S5/0239 ,  H01S5/024 ,  H01S5/026

Abstract: A method for manufacturing a hermetic side looking laser surface-mount device (SMD) package includes forming a glass cap. An array of pockets is formed in the first glass wafer. The array of pockets is sealed by bonding a second glass wafer to the first glass wafer. The glass cap is released by singulating the sealed array of pockets.

公开(公告)号：EP4136719A1

公开(公告)日：2023-02-22

申请号：EP21725855.7

申请日：2021-04-15

Applicant: EXCELITAS CANADA, INC.

Inventor： JU, Jin Han ,  CHARLEBOIS, Gabriel

IPC: H01S5/02208 ,  H01S5/02218 ,  H01S5/02345 ,  H01S5/40 ,  H01S5/02257 ,  H01S5/0239 ,  H01S5/024 ,  H01S5/026