A PANEL PROFILE AND METHOD FOR MANUFACTURING THEREOF

    公开(公告)号:FI20205867A1

    公开(公告)日:2022-03-08

    申请号:FI20205867

    申请日:2020-09-07

    Abstract: The present disclosure describes a pultruded panel profile (40) with a sandwich structure and a method of manufacturing such a panel profile. The sandwich structure has at least one a core layer (42) and surface layers (44) on both sides of the sandwich structure. The core layer (42) comprises at least one signal window section (46) made of a signal-transparent material, the signal-transparent material being substantially transparent to at least one wireless signal. The core layer further comprises a peripheral section (48a, 48b) surrounding the signal window section (46), the peripheral section (48a, 48b) having a different material composition than the signal window section (46).

    A PANEL PROFILE AND METHOD FOR MANUFACTURING THEREOF

    公开(公告)号:FI20205867A

    公开(公告)日:2022-03-08

    申请号:FI20205867

    申请日:2020-09-07

    Abstract: The present disclosure describes a pultruded panel profile (40) with a sandwich structure and a method of manufacturing such a panel profile. The sandwich structure has at least one a core layer (42) and surface layers (44) on both sides of the sandwich structure. The core layer (42) comprises at least one signal window section (46) made of a signal-transparent material, the signal-transparent material being substantially transparent to at least one wireless signal. The core layer further comprises a peripheral section (48a, 48b) surrounding the signal window section (46), the peripheral section (48a, 48b) having a different material composition than the signal window section (46).

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