公开(公告)号：US20180001440A1

公开(公告)日：2018-01-04

申请号：US15615375

申请日：2017-06-06

Applicant: Ebara Corporation

Inventor： Hiroshi AONO ,  Kuniaki YAMAGUCHI ,  Hiroshi SHIMOMOTO ,  Koji MAEDA ,  Tetsuya YASHIMA ,  Kenji SHINKAI ,  Koichi HASHIMOTO ,  Mitsuhiko INABA ,  Hidetatsu ISOKAWA ,  Hidetaka NAKAO ,  Soichi ISOBE

IPC: B24B37/34 ,  H01L21/67 ,  B24B37/10 ,  B08B3/12 ,  B08B1/04 ,  H01L21/687 ,  B08B1/00

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.