公开(公告)号：US20130187197A1

公开(公告)日：2013-07-25

申请号：US13651638

申请日：2012-10-15

Applicant: Electronics and Telecommunications Research In

Inventor： Jong-Won LIM ,  Ho Kyun AHN ,  Young Rak PARK ,  Dong Min KANG ,  Woo Jin CHANG ,  Seong-Il KIM ,  Sung Bum BAE ,  Sang-Heung LEE ,  Hyung Sup YOON ,  Chull Won JU ,  Jae Kyoung MUN ,  Eun Soo NAM

IPC: H01L29/778 ,  H01L21/335

CPC classification number: H01L29/66431 ,  H01L21/28255 ,  H01L21/31116 ,  H01L21/31144 ,  H01L29/1608 ,  H01L29/42316 ,  H01L29/42376 ,  H01L29/66068 ,  H01L29/7787

Abstract: Disclosed is a manufacturing method of a high electron mobility transistor. The method includes: forming a source electrode and a drain electrode on a substrate; forming a first insulating film having a first opening on an entire surface of the substrate, the first opening exposing a part of the substrate; forming a second insulating film having a second opening within the first opening, the second opening exposing a part of the substrate; forming a third insulating film having a third opening within the second opening, the third opening exposing a part of the substrate; etching a part of the first insulating film, the second insulating film and the third insulating film so as to expose the source electrode and the drain electrode; and forming a T-gate electrode on a support structure including the first insulating film, the second insulating film and the third insulating film.