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公开(公告)号：US20170236909A1
公开(公告)日：2017-08-17
申请号：US15248676
申请日：2016-08-26
Inventor： Ho Kyun AHN , Dong Min KANG , Yong-Hwan KWON , Dong-Young KIM , SEONG IL KIM , Hae Cheon KIM , Eun Soo NAM , Jae Won DO , Byoung-Gue MIN , Hyung Sup YOON , Sang-Heung LEE , Jong Min LEE , Jong-Won LIM , Hyun Wook JUNG , Kyu Jun CHO
IPC: H01L29/40 , H01L29/66 , H01L29/778 , H01L29/20 , H01L29/205
CPC classification number: H01L29/404 , H01L21/6835 , H01L29/0619 , H01L29/0657 , H01L29/2003 , H01L29/205 , H01L29/401 , H01L29/4175 , H01L29/66462 , H01L29/7786 , H01L29/7787 , H01L2221/68327 , H01L2221/6834
Abstract: A high electron mobility transistor includes a substrate including a first surface and a second surface facing each other and having a via hole passing through the first surface and the second surface, an active layer on the first surface, a cap layer on the active layer and including a gate recess region exposing a portion of the active layer, a source electrode and a drain electrode on one of the cap layer and the active layer, an insulating layer on the source electrode and the drain electrode and having on opening corresponding to the gate recess region to expose the gate recess region, a first field electrode on the insulating layer, a gate electrode electrically connected to the first field electrode on the insulating layer, and a second field electrode on the second surface and contacting the active layer through the via hole.
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公开(公告)号：US20170133471A1
公开(公告)日：2017-05-11
申请号：US15238492
申请日：2016-08-16
Inventor： Jong Min LEE , Byoung-Gue MIN , Hyung Sup YOON , Dong Min KANG , Dong-Young KIM , SEONG-IL KIM , Hae Cheon KIM , Jae Won DO , Ho Kyun AHN , Sang-Heung LEE , Jong-Won LIM , Hyun Wook JUNG , Kyu Jun CHO , Chull Won JU
IPC: H01L29/40 , H01L29/66 , H01L29/778 , H01L29/20 , H01L29/205
CPC classification number: H01L29/408 , H01L29/2003 , H01L29/205 , H01L29/66462 , H01L29/7786 , H01L29/7787
Abstract: The present invention relates to a high reliability field effect power device and a manufacturing method thereof. A method of manufacturing a field effect power device includes sequentially forming a transfer layer, a buffer layer, a barrier layer and a passivation layer on a substrate, patterning the passivation layer by etching a first region of the passivation layer, and forming at least one electrode on the first region of the barrier layer exposed by patterning the passivation layer, wherein the first region is provided to form the at least one electrode, and the passivation layer may include a material having a wider bandgap than the barrier layer to prevent a trapping effect and a leakage current of the field effect power device.
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公开(公告)号：US20230054026A1
公开(公告)日：2023-02-23
申请号：US17891832
申请日：2022-08-19
Inventor： Hyun Wook JUNG , Seong II KIM , Hae Cheon KIM , Youn Sub NOH , Ho Kyun AHN , Sang Heung LEE , Jong Won LIM , Sung Jae CHANG , II Gyu CHOI
IPC: H01L29/778 , H01L29/66 , H01L29/423 , H01L29/40
Abstract: Provided are a nitride-based high electron mobility transistor having enhanced frequency characteristics and an improved structural stability and manufacturing method thereof. The nitride-based high electron mobility transistor includes a first semiconductor layer and a second semiconductor layer sequentially formed on a substrate, source drain electrodes formed on the second semiconductor layer, a first insulating film formed on the second semiconductor layer and having an opening, a dielectric formed on the first insulating film to surround the opening of the first insulating film, a second insulating film formed on an inner sidewall of the dielectric, and a gate electrode formed on the dielectric to fill the opening of the first insulating film and inside the inner sidewall of the dielectric. A width of the inner sidewall at a bottom end of the dielectric is smaller than a width of the inner sidewall at a top end of the dielectric.
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公开(公告)号：US20220285244A1
公开(公告)日：2022-09-08
申请号：US17562587
申请日：2021-12-27
Inventor： Il Gyu CHOI , Seong Il KIM , Hae Cheon KIM , Youn Sub NOH , Ho Kyun AHN , Sang Heung LEE , Jong Won LIM , Sung Jae CHANG , Hyun Wook JUNG
IPC: H01L23/373
Abstract: The present invention improves a heat dissipation property of a semiconductor device by transferring hexagonal boron nitride (hBN) with a two-dimensional nanostructure to the semiconductor device. A semiconductor device of the present invention includes a substrate having a first surface and a second surface, a semiconductor layer formed on the first surface of the substrate, an hBN layer formed on at least one surface of the first surface and the second surface of the substrate, and a heat sink positioned on the second surface of the substrate. A radiation rate of heat generated during driving of an element is increased to decrease a reduction in lifetime of a semiconductor device due to a temperature increase. The semiconductor device has a structure and configuration which are very effective in improving a rapid temperature increase due to heat generated by high-power semiconductor devices.
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公开(公告)号：US20170237171A1
公开(公告)日：2017-08-17
申请号：US15229891
申请日：2016-08-05
Inventor： Dong-Young KIM , Dong Min KANG , SEONG-IL KIM , Hae Cheon KIM , Jae Won DO , Byoung-Gue MIN , Ho Kyun AHN , Hyung Sup YOON , Sang-Heung LEE , Jong Min LEE , Jong-Won LIM , Yoo Jin JANG , Hyun Wook JUNG , Kyu Jun CHO , Chull Won JU
CPC classification number: H01Q9/0407 , H01Q1/50 , H01Q9/0442
Abstract: Provided herein is a patch antenna including a multilayered substrate on which a plurality of dielectric layers are laminated; at least one metal pattern layer disposed between the plurality of dielectric layers outside a central area of the multilayered substrate; an antenna patch disposed on an upper surface of the multilayered substrate and within the central area; a ground layer disposed on a lower surface of the multilayered substrate; a plurality of connection via patterns penetrating the plurality of dielectric layers to connect the metal pattern layer and the ground layer, and surrounding the central area; a transmission line comprising a first transmission line unit disposed on the upper surface of the multilayered substrate and located outside the central area, and a second transmission line unit disposed on the upper surface of the multilayered substrate and located within the central area; and an impedance transformer located below the second transmission line unit within the central area of the multilayered substrate.
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Patent Agency Ranking
6.发明申请SEMICONDUCTOR DEVICE HAVING STABLE GATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权具有稳定的门结构的半导体器件及其制造方法公开(公告)号：US20150236108A1
公开(公告)日：2015-08-20
申请号：US14328247
申请日：2014-07-10
Inventor： Seong Il KIM , Dong Min KANG , Sang Heung LEE , Ho Kyun AHN , Hyung Sup YOON , Byoung Gue MIN , Jong Won LIM
IPC: H01L29/423 , H01L21/283 , H01L29/778
CPC classification number: H01L29/42312 , H01L21/28114 , H01L21/28587 , H01L21/28593 , H01L29/42316 , H01L29/66863 , H01L29/778 , H01L29/812
Abstract: Disclosed are a semiconductor device having a stable gate structure, and a manufacturing method thereof, in which a gate structure is stabilized by additionally including a plurality of gate feet under a gate head in a width direction of the gate head so as to serve as supporters in a gate structure including a fine gate foot having a length of 0.2 μm or smaller, and the gate head having a predetermined size. Accordingly, it is possible to prevent the gate electrode of the semiconductor device from collapsing, and improve reliability of the semiconductor device during or after the process of the semiconductor device.
Abstract translation: 公开了一种具有稳定的栅极结构的半导体器件及其制造方法，其中通过在栅极头的宽度方向上的栅极头附近还包括多个栅极脚来稳定栅极结构，以作为支撑体 在包括具有0.2μm或更小的长度的精细栅极脚的栅极结构中，并且栅极头具有预定尺寸。 因此，可以防止半导体器件的栅电极塌陷，并且在半导体器件的处理期间或之后提高半导体器件的可靠性。
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公开(公告)号：US20150380482A1
公开(公告)日：2015-12-31
申请号：US14658121
申请日：2015-03-13
Inventor： Ho Kyun AHN , Hae Cheon KIM , Jong Won LIM , Dong Min KANG , Yong Hwan KWON , SEONG IL KIM , Zin Sig KIM , Eun Soo NAM , Byoung Gue MIN , Hyung Sup YOON , Kyung Ho LEE , Jong Min LEE , Kyu Jun CHO
IPC: H01L29/06 , H01L29/66 , H01L29/205 , H01L29/20 , H01L21/28 , H01L29/49 , H01L29/423 , H01L21/02 , H01L21/311 , H01L21/31 , H01L29/778 , H01L29/45
CPC classification number: H01L21/28264 , H01L29/2003 , H01L29/407 , H01L29/42316 , H01L29/4236 , H01L29/452 , H01L29/51 , H01L29/513 , H01L29/517 , H01L29/518 , H01L29/66462 , H01L29/7786
Abstract: Provided herein is a semiconductor device including a substrate; an active layer formed on top of the substrate; a protective layer formed on top of the active layer and having a first aperture; a source electrode, driving gate electrode and drain electrode formed on top of the protective layer; and a first additional gate electrode formed on top of the first aperture, wherein an electric field is applied to the active layer, protective layer and driving gate electrode due to a voltage applied to each of the source electrode, drain electrode and driving gate electrode, and the first additional gate electrode is configured to attenuate a size of the electric field applied to at least a portion of the active layer, protective layer and driving gate electrode.
Abstract translation: 本文提供了包括基板的半导体器件; 形成在所述基板的顶部上的有源层; 形成在所述有源层的顶部上并具有第一孔的保护层; 源电极，形成在保护层顶部的驱动栅电极和漏电极; 以及形成在所述第一孔的顶部上的第一附加栅电极，其中由于施加到所述源电极，漏电极和驱动栅电极中的每一个的电压，向所述有源层，保护层和驱动栅电极施加电场， 并且第一附加栅电极被配置为衰减施加到有源层，保护层和驱动栅电极的至少一部分的电场的尺寸。
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公开(公告)号：US20150270822A1
公开(公告)日：2015-09-24
申请号：US14478295
申请日：2014-09-05
Inventor： Dong Min KANG , Seong Il KIM , Sang Heung LEE , Chull Won JU , Ho Kyun AHN , Hyung Sup YOON , Jong Won LIM
IPC: H03H7/38
CPC classification number: H03H7/38 , H01L23/642 , H01L2224/49175 , H01P1/2039 , H01P5/12 , H05K1/025 , H05K2201/09781
Abstract: Provided herein is a component package including a matching unit and a matching method thereof, the matching unit including: a substrate; a transmission line formed on the substrate, the transmission line being connected to a terminal of the component package; a bonding wire electrically connecting the transmission line and a central component; and a capacitor unit having a plurality of capacitors electrically connected with the transmission line by wiring connection, wherein an inductance of the matching unit is variable by adjusting a length of the bonding wire, and a capacitance of the matching unit is variable by increasing or reducing the number of capacitors electrically connected to the transmission line, of among the capacitors inside the capacitor unit, by extending or cutting off the wiring connection.
Abstract translation: 本文提供了一种包括匹配单元及其匹配方法的组件封装，所述匹配单元包括：衬底; 形成在所述基板上的传输线，所述传输线连接到所述部件封装的端子; 电连接所述传输线和中心部件的接合线; 以及具有通过布线连接与传输线电连接的多个电容器的电容器单元，其中匹配单元的电感通过调整接合线的长度而变化，并且匹配单元的电容可通过增加或减小而变化 通过延长或切断布线连接，在电容器单元内的电容器之间电连接到传输线的电容器的数量。
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9.发明申请FIELD-EFFECT TRANSISTOR FOR HIGH VOLTAGE DRIVING AND MANUFACTURING METHOD THEREOF 审中-公开用于高压驱动的场效应晶体管及其制造方法公开(公告)号：US20150194494A1
公开(公告)日：2015-07-09
申请号：US14243322
申请日：2014-04-02
Inventor： Ho Kyun AHN , Hae Cheon KIM , Zin Sig KIM , Sang Heung LEE , Byoung Gue MIN , Hyung Sup YOON , Dong Min KANG , Seong Il KIM , Jong Min LEE , Jong Won LIM , Yong Hwan KWON , Eun Soo NAM
IPC: H01L29/40 , H01L29/66 , H01L21/28 , H01L21/283 , H01L29/78 , H01L29/423
CPC classification number: H01L29/402 , H01L21/283 , H01L21/28593 , H01L29/2003 , H01L29/42312 , H01L29/42356 , H01L29/66462 , H01L29/66477 , H01L29/7787
Abstract: Disclosed are a field effect transistor for high voltage driving including a gate electrode structure in which a gate head extended in a direction of a drain is supported by a field plate embedded under a region of the gate head so as to achieve high voltage driving, and a manufacturing method thereof. Accordingly, the gate head extended in the direction of the drain is supported by the field plate electrically spaced by using an insulating layer, so that it is possible to stably manufacture a gate electrode including the extended gate head, and gate resistance is decreased by the gate head extended in the direction of the drain and an electric field peak value between the gate and the drain is decreased by the gate electrode including the gate head extended in the direction of the drain and the field plate proximate to the gate, thereby achieving an effect in that a breakdown voltage of a device is increased.
Abstract translation: 公开了一种用于高电压驱动的场效应晶体管，其包括栅极电极结构，其中在漏极方向上延伸的栅极头由嵌入在栅极头的区域内的场板支撑以实现高电压驱动，以及 其制造方法。 因此，在漏极方向上延伸的栅极头通过使用绝缘层而被电隔离的场板支撑，使得可以稳定地制造包括延伸栅极头的栅电极，并且栅极电阻通过 栅极头在漏极的方向上延伸，栅极和漏极之间的电场峰值由包括在漏极方向上延伸的栅极和靠近栅极的场板的栅电极减小，由此实现 效果是器件的击穿电压增加。
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公开(公告)号：US20150144961A1
公开(公告)日：2015-05-28
申请号：US14175452
申请日：2014-02-07
Inventor： Hyung Sup YOON , Byoung Gue MIN , Ho Kyun AHN , Jong Won LIM , Dong Min KANG , Jong Min LEE
IPC: H01L29/778 , H01L29/45 , H01L29/66
CPC classification number: H01L29/42316 , H01L29/2003 , H01L29/452 , H01L29/66462 , H01L29/7786
Abstract: A high frequency device includes: a capping layer formed on an epitaxial structure; source and drain electrodes formed on the capping layer; a multilayer insulating pattern formed on entire surfaces of the source and drain electrodes and the capping layer in a step shape; a T-shaped gate passing through the multilayer insulating pattern and the capping layer to be in contact with the epitaxial structure; and a passivation layer formed along entire surfaces of the T-shaped gate and the multilayer insulating pattern.
Abstract translation: 高频器件包括：形成在外延结构上的覆盖层; 源极和漏极形成在覆盖层上; 形成在所述源电极和漏电极以及所述覆盖层的整个表面上的阶梯形状的多层绝缘图案; 通过所述多层绝缘图案和所述覆盖层与所述外延结构接触的T形栅极; 以及在T形栅极和多层绝缘图案的整个表面上形成的钝化层。
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