公开(公告)号：WO1987003537A1

公开(公告)日：1987-06-18

申请号：PCT/US1985002424

申请日：1985-12-12

Applicant: FLEXCON COMPANY, INC.

Inventor： FLEXCON COMPANY, INC. ,  PENNACE, John ,  BORASSO, Sharon

IPC: B32B07/06

CPC classification number: C09J7/401 ,  C09J2483/005

Abstract: A silicone release laminate formed by a support layer (11) with a silicone release layer (13). A separate pressure-sensitive silicone adhesive layer (12) may be on the same side of the support as the release layer, or on opposite sides of the support. The force required to separate the adhesive from the release layer is less than about 100 grams (3.3 oz.) per inch, and preferably less than 50 grams (1.7 oz.) per inch. The release layer is formed from one or more organopolysiloxanes having a viscosity below 1000 centipoises, and preferably below about 600 centipoises, with a high degree of cross-linking. The organopolysiloxanes may be produced directly by hydrolysis of organo-substituted halosiloxanes and depolymerization; or by hydration of higher molecular weight organopolysiloxanes and heat treatment to produce lower weight constituents.

Abstract translation: 由具有硅氧烷剥离层（13）的支撑层（11）形成的硅氧烷剥离层压体。 单独的压敏硅氧烷粘合剂层（12）可以在支撑体的与释放层相同的一侧上，或者在支撑体的相对侧上。 将粘合剂从剥离层分离所需的力小于每英寸约100克（3.3盎司），优选小于每英寸50克（1.7盎司）。 脱模层由粘度低于1000厘泊，优选低于约600厘泊，具有高度交联度的一种或多种有机聚硅氧烷形成。 有机聚硅氧烷可以通过有机取代的卤代硅氧烷的水解直接制备和解聚; 或通过水合较高分子量的有机聚硅氧烷并进行热处理以产生较低重量的成分。

公开(公告)号：WO2008091796A2

公开(公告)日：2008-07-31

申请号：PCT/US2008/051451

申请日：2008-01-18

Applicant: FLEXcon Company, Inc. ,  SKOV, Richard ,  BARKER, Eric ,  BURNHAM, Kenneth ,  CHO, Winsor ,  TOMAS, Stephen ,  PENNACE, John

Inventor： SKOV, Richard ,  BARKER, Eric ,  BURNHAM, Kenneth ,  CHO, Winsor ,  TOMAS, Stephen ,  PENNACE, John

CPC classification number: B32B27/18 ,  B32B2307/202 ,  B32B2457/00 ,  H05K9/0079

Abstract: A laminate of dielectric materials is disclosed for use in protecting an electronic device. The laminate includes at least one layer of a polymeric material having an active material dispersed within the polymeric material and having a first thickness. The active material is responsive to external electric fields such that a higher voltage external electric field may be applied to one side of the laminate without any voltage passing through the laminate than a maximum voltage that could be applied to the laminate without passing through the laminate when the active material is not present within the polymeric material having the first thickness.

Abstract translation: 公开了用于保护电子设备的电介质材料层压体。 层压体包括至少一层具有分散在聚合材料内并具有第一厚度的活性材料的聚合物材料。 活性材料响应于外部电场，使得可以将较高电压的外部电场施加到层压体的一侧，而没有任何电压通过层压体，而不是可以施加到层压板上的最大电压，而不通过层压体， 活性材料不存在于具有第一厚度的聚合材料内。

公开(公告)号：EP0250400A1

公开(公告)日：1988-01-07

申请号：EP86900458.0

申请日：1985-12-12

Applicant: FLEXCON COMPANY, INC.

Inventor： PENNACE, John ,  BORASSO, Sharon

IPC: B05D7 ,  B32B7 ,  C08L83 ,  C09J7 ,  C09J183

CPC classification number: C09J7/401 ,  C09J2483/005

Abstract: A silicone release laminate formed by a support layer (11) with a silicone release layer (13). A separate pressure-sensitive silicone adhesive layer (12) may be on the same side of the support as the release layer, or on opposite sides of the support. The force required to separate the adhesive from the release layer is less than about 100 grams (3.3 oz.) per inch, and preferably less than 50 grams (1.7 oz.) per inch. The release layer is formed from one or more organopolysiloxanes having a viscosity below 1000 centipoises, and preferably below about 600 centipoises, with a high degree of cross-linking. The organopolysiloxanes may be produced directly by hydrolysis of organo-substituted halosiloxanes and depolymerization; or by hydration of higher molecular weight organopolysiloxanes and heat treatment to produce lower weight constituents.

Abstract translation: 由支撑层（11）和硅酮防粘层（13）组成的硅酮防粘层压板。 单独的压敏硅氧烷粘合剂层（12）可以位于载体的与释放层相同的一侧上，或位于载体的相对侧上。 将粘合剂与防粘层分离所需的力小于每英寸100克（3.3盎司），并且优选小于每英寸50克（1.7盎司）。 释放层由一种或多种粘度小于1000厘泊，优选小于约600厘泊，具有高交联度的有机聚硅氧烷组成。 有机聚硅氧烷可以通过水解有机取代的卤代硅氧烷并通过解聚，或通过水合较高分子量的有机聚硅氧烷和通过热处理以产生较低分子量的组分直接制备。