公开(公告)号：US09513172B2

公开(公告)日：2016-12-06

申请号：US13750709

申请日：2013-01-25

Applicant: FLIR Systems, Inc.

Inventor： Gregory A. Carlson ,  Alex Matson ,  Andrew Sharpe ,  Davey Beard ,  Paul Schweikert ,  Robert Simes

IPC: G01J5/10 ,  G01J5/04 ,  H04N5/225 ,  H04N5/33 ,  G01J5/02 ,  G01J5/20 ,  G01J1/02 ,  G01J1/44 ,  H01L27/146 ,  G01J5/00

CPC classification number: G01J5/20 ,  G01J1/0204 ,  G01J1/44 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/046 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/204 ,  H01L22/14 ,  H01L22/32 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14669 ,  H01L27/14687 ,  H01L27/14698 ,  H01L37/02 ,  H04N5/2251 ,  H04N5/33 ,  Y10T29/49826

Abstract: An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.

Abstract translation: 用于例如红外相机的红外检测器包括具有红外检测器阵列的基板和与设置在其上表面上的阵列互连的读出集成电路，用于一个或多个实施例。 大致平面的窗口在阵列上方间隔开，窗口基本上对于红外光是透明的。 台面粘合到窗户。 台面已经封闭了边缘侧壁，其设置在窗口的下表面的外周边和基板的上表面的外周之间，并且在窗口和包围阵列的阵列之间限定了封闭的空腔。 焊接密封件将台面连接到基板以便密封空腔。

公开(公告)号：US20160047691A1

公开(公告)日：2016-02-18

申请号：US13750709

申请日：2013-01-25

Applicant: FLIR Systems, Inc.

Inventor： Gregory A. Carlson ,  Alex Matson ,  Andrew Sharpe ,  Davey Beard ,  Paul Schweikert ,  Robert Simes

IPC: G01J5/10 ,  H01L27/146 ,  G01J1/02 ,  G01J1/44 ,  G01J5/02

CPC classification number: G01J5/20 ,  G01J1/0204 ,  G01J1/44 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/046 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/204 ,  H01L22/14 ,  H01L22/32 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14669 ,  H01L27/14687 ,  H01L27/14698 ,  H01L37/02 ,  H04N5/2251 ,  H04N5/33 ,  Y10T29/49826

Abstract: An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.

Abstract translation: 用于例如红外相机的红外检测器包括具有红外检测器阵列的基板和与设置在其上表面上的阵列互连的读出集成电路，用于一个或多个实施例。 大致平面的窗口在阵列上方间隔开，窗口基本上对于红外光是透明的。 台面粘合到窗户。 台面已经封闭了边缘侧壁，其设置在窗口的下表面的外周边和基板的上表面的外周之间，并且在窗口和包围阵列的阵列之间限定了封闭的空腔。 焊接密封件将台面连接到基板以便密封空腔。

公开(公告)号：US10161803B2

公开(公告)日：2018-12-25

申请号：US15369702

申请日：2016-12-05

Applicant: FLIR Systems, Inc.

Inventor： Gregory A. Carlson ,  Alex Matson ,  Andrew Sharpe ,  Davey Beard ,  Paul Schweikert ,  Robert Simes

IPC: G01J5/20 ,  G01J5/04 ,  H04N5/225 ,  H04N5/33 ,  G01J5/02 ,  G01J1/02 ,  G01J1/44 ,  G01J5/10 ,  H01L27/146 ,  H01L21/66 ,  H01L37/02 ,  G01J5/00

Abstract: An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.

公开(公告)号：US20140186999A1

公开(公告)日：2014-07-03

申请号：US14141300

申请日：2013-12-26

Applicant: FLIR Systems, Inc.

Inventor： Paul Schweikert ,  Andrew Sharpe ,  Gregory A. Carlson ,  Alex Matson ,  Scott Vilander ,  Bob Zahuta ,  Richard M. Goeden

IPC: H01L21/50

CPC classification number: H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67757 ,  H01L21/681 ,  H01L21/6831 ,  H01L24/94 ,  H01L31/0203 ,  H01L31/09 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/41 ,  H01L2924/00

Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

Abstract translation: 在一个实施例中，用于微测辐射热量计真空封装组件（VPA）的晶片级封装（WLP）的装置包括：晶片对准和结合室，测辐射热计晶片卡盘和设置在腔室内的垂直面对面的盖晶片卡盘 彼此之间，用于在室内产生第一超高真空（UHV）环境的装置，用于彼此独立地加热和冷却测辐射热计晶片卡盘和盖晶片卡盘的装置，用于将盖晶片卡盘移动到垂直方向 方向并且相对于测辐射热量计晶片卡盘，用于在水平面中沿两个正交方向平移移动测辐射热计晶片夹盘并围绕垂直于水平面的垂直轴线旋转移动的装置，以及用于使由基准点 在由盖子晶片卡盘保持的盖子晶片上具有基准的测辐射热计晶片卡盘。

公开(公告)号：US10553454B2

公开(公告)日：2020-02-04

申请号：US15682459

申请日：2017-08-21

Applicant: FLIR Systems, Inc.

Inventor： Paul Schweikert ,  Andrew Sharpe ,  Gregory A. Carlson ,  Alex Matson ,  Scott Vilander ,  Bob Zahuta ,  Richard M. Goeden

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L21/50 ,  H01L31/09 ,  H01L31/0203 ,  B81C1/00 ,  H01L23/00

Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

公开(公告)号：US20170372920A1

公开(公告)日：2017-12-28

申请号：US15682459

申请日：2017-08-21

Applicant: FLIR Systems, Inc.

Inventor： Paul Schweikert ,  Andrew Sharpe ,  Gregory A. Carlson ,  Alex Matson ,  Scott Vilander ,  Bob Zahuta ,  Richard M. Goeden

IPC: H01L21/50 ,  B81C1/00 ,  H01L21/67 ,  H01L31/0203 ,  H01L21/683 ,  H01L21/68 ,  H01L21/677 ,  H01L31/09 ,  H01L23/00

Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

公开(公告)号：US20170328779A1

公开(公告)日：2017-11-16

申请号：US15369702

申请日：2016-12-05

Applicant: FLIR Systems, Inc.

Inventor： Gregory A. Carlson ,  Alex Matson ,  Andrew Sharpe ,  Davey Beard ,  Paul Schweikert ,  Robert Simes

IPC: G01J5/20 ,  G01J1/02 ,  H01L27/146 ,  H01L21/66 ,  G01J5/04 ,  G01J5/02 ,  G01J1/44 ,  H01L37/02

CPC classification number: G01J5/20 ,  G01J1/0204 ,  G01J1/44 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/046 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/204 ,  H01L22/14 ,  H01L22/32 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14669 ,  H01L27/14687 ,  H01L27/14698 ,  H01L37/02 ,  H04N5/2251 ,  H04N5/33 ,  Y10T29/49826

Abstract: An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.

公开(公告)号：US09741591B2

公开(公告)日：2017-08-22

申请号：US14141300

申请日：2013-12-26

Applicant: FLIR Systems, Inc.

Inventor： Paul Schweikert ,  Andrew Sharpe ,  Gregory A. Carlson ,  Alex Matson ,  Scott Vilander ,  Bob Zahuta ,  Richard M. Goeden

IPC: H01L21/50 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L31/09 ,  H01L31/0203 ,  B81C1/00 ,  H01L23/00

CPC classification number: H01L21/50 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67757 ,  H01L21/681 ,  H01L21/6831 ,  H01L24/94 ,  H01L31/0203 ,  H01L31/09 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16235 ,  Y10T29/41 ,  H01L2924/00

Abstract: An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.