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公开(公告)号：KR20180030710A
公开(公告)日：2018-03-23
申请号：KR20187006606
申请日：2017-02-23
Applicant: FUJIFILM CORP
Inventor： IWAI YU , KAWABATA TAKESHI , SHIBUYA AKINORI
IPC: B32B7/02 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/28 , G03F7/027 , G03F7/20 , G03F7/40 , H01L23/12 , H01L23/14
CPC classification number: B32B7/02 , B32B27/00 , B32B27/34 , G03F7/027 , G03F7/40 , H01L23/12 , H01L23/14
Abstract: 수지층과수지층의밀착성이우수한적층체, 및적층체의제조방법, 반도체디바이스, 및반도체디바이스의제조방법의제공. 기판과, 적어도 2층의수지층을갖고, 상기수지층은각각독립적으로막면의적어도일부에있어서다른수지층과접하고있고, 각각독립적으로영률이 2.8㎬를초과하고 5.0㎬이하, 또한, 파단신도가 50%를초과하고 200% 이하이며, 또한, 3차원라디칼가교구조를갖고, 상기수지층중 적어도 1층은폴리이미드및 폴리벤조옥사졸중 적어도 1종을포함하는적층체.
Abstract translation: 树脂层与树脂层的密合性优异的层压体及层压体的制造方法，半导体装置以及半导体装置的制造方法。 具有上述基板的树脂层，至少两个层，该树脂层可以在薄膜表面的至少一部分与其它树脂层接触，各自独立地，各自独立地为杨氏模量超过2.8㎬和5.0㎬或更小，并且断裂伸长率 大于50％且不大于200％，并且具有三维自由基交联结构，并且至少一个树脂层含有聚酰亚胺和聚苯并恶唑中的至少一种。
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2.发明专利
公开(公告)号：BR112013030220A2
公开(公告)日：2016-12-13
申请号：BR112013030220
申请日：2012-04-12
Applicant: FUJIFILM CORP
Inventor： OOHASHI HIDEKAZU , MORI TAKANORI , IWAI YU
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公开(公告)号：DE602008003864D1
公开(公告)日：2011-01-20
申请号：DE602008003864
申请日：2008-06-23
Applicant: FUJIFILM CORP
Inventor： SUZUKI SHOTA , IWAI YU , KAWAGUCHI JUNJI
IPC: B41C1/10
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公开(公告)号：DE602006021374D1
公开(公告)日：2011-06-01
申请号：DE602006021374
申请日：2006-09-27
Applicant: FUJIFILM CORP
Inventor： IWAI YU , OOHASHI HIDEKAZU
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公开(公告)号：DE602008002963D1
公开(公告)日：2010-11-25
申请号：DE602008002963
申请日：2008-06-30
Applicant: FUJIFILM CORP
Inventor： IWAI YU , AOSHIMA NORIO
IPC: B41C1/10
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Patent Agency Ranking
公开(公告)号：DE602008001572D1
公开(公告)日：2010-08-05
申请号：DE602008001572
申请日：2008-03-20
Applicant: FUJIFILM CORP
Inventor： IWAI YU , AOSHIMA NORIO
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7.发明专利
公开(公告)号：PH12018550034A1
公开(公告)日：2018-09-24
申请号：PH12018550034
申请日：2018-03-27
Applicant: FUJIFILM CORP
Inventor： KAWABATA TAKESHI , IWAI YU , SHIBUYA AKINORI
IPC: C08F290/14 , C08F299/02 , C08G73/10 , C08G73/22 , G03F7/027 , G03F7/20 , H01L21/312
Abstract: Provided are: a resin which is capable of forming a cured film (a pattern) that is suppressed in warping, while having excellent film uniformity and less scum (residue); a composition which uses this resin; a cured film; a method for producing a cured film; and a semiconductor device. A resin which is selected from among polyimide precursors, polyimides, polybenzoxazole precursors and polybenzoxazoles, and which has a polymerizable group, while containing components having molecular weights of 1,000 or less in an amount of 0.005-1.0 pcnt by mass in total.
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公开(公告)号：AT511990T
公开(公告)日：2011-06-15
申请号：AT06017770
申请日：2006-08-25
Applicant: FUJIFILM CORP
Inventor： IWAI YU , OOHASHI HIDEKAZU , SHIMADA KAZUTO
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公开(公告)号：AT471812T
公开(公告)日：2010-07-15
申请号：AT08005296
申请日：2008-03-20
Applicant: FUJIFILM CORP
Inventor： IWAI YU , AOSHIMA NORIO
Abstract: A negative lithographic printing plate precursor includes a support; and a photo-polymerization layer containing a polymer compound having at least one of a sulfonamido group and a cyclic structure derived from maleimide, and further having a hydrophilic group in a molecule thereof,
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公开(公告)号：PH12019550009A1
公开(公告)日：2020-01-20
申请号：PH12019550009
申请日：2019-01-15
Applicant: FUJIFILM CORP
Inventor： IWAI YU , VANCLOOSTER STEFAN , JANSSEN DIMITRI , BAERT KASPER
Abstract: Provided are: a photosensitive resin composition which can ring-close at a high ring-closing rate even at a lower temperature and can be cured into a cured film having a high glass transition temperature; and a cured film, a laminate, a method for producing a cured film, a method for producing a laminate, and a semiconductor device, in each of which the photosensitive resin composition is used. A photosensitive resin composition comprising a polymer precursor containing a heterocyclic ring, a thermobase generator, and an organic compound containing a Group-IV element.
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