1.
    发明专利
    未知

    公开(公告)号:DE602004012675T2

    公开(公告)日:2009-04-09

    申请号:DE602004012675

    申请日:2004-08-20

    Applicant: FUJIFILM CORP

    Abstract: The present invention provides: a method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by a cross-linking reaction, forming a graft polymer region in a pattern on the surface of the polymerization initiation layer, wherein the graft polymer layer has the ability to contain a metal ion or a metal salt, adding a metal ion or a metal salt to the graft polymer layer, and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal fine particle dispersion region; and a method of forming an electroconductive pattern using the method of forming a metal fine particle pattern.

    2.
    发明专利
    未知

    公开(公告)号:DE602004012675D1

    公开(公告)日:2008-05-08

    申请号:DE602004012675

    申请日:2004-08-20

    Applicant: FUJIFILM CORP

    Abstract: The present invention provides: a method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by a cross-linking reaction, forming a graft polymer region in a pattern on the surface of the polymerization initiation layer, wherein the graft polymer layer has the ability to contain a metal ion or a metal salt, adding a metal ion or a metal salt to the graft polymer layer, and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal fine particle dispersion region; and a method of forming an electroconductive pattern using the method of forming a metal fine particle pattern.

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