Abstract:
A photosensitive resin composition includes (a) a resin comprising a repeating unit represented by a following formula (1); (b) a photosensitive agent; (c) a thermo-acid generator; and (d) a compound having at least one of an alkoxymethyl group and an acyloxymethyl group, wherein R 1 represents a divalent to octavalent organic group containing 2 or more carbon atoms, R 2 represents a divalent to hexavalent organic group containing 2 or more carbon atoms, each of R 0 and R 3 independently represents a hydrogen atom or an organic group containing 1 to 20 carbon atoms, m represents an integer of 0 to 2, and each of p and q represents an integer of 0 to 4, provided that p + q > 0.
Abstract:
PROBLEM TO BE SOLVED: To provide a surface treatment agent and a resist composition for a freezing process being applied to the first resist pattern in a double patterning method and satisfying the requirements for preventing line width and LWR of the first resist pattern from fluctuating due to the freezing process and the formation of the second resist pattern and resist composition and to provide a pattern formation process by use of them. SOLUTION: This surface treatment agent for forming the resist pattern contains a compound having two nucleophilic functional groups or more in one molecule or its salt and solvent. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To solve problems of a performance improving technique in microfabrication of a semiconductor element using actinic rays or radiation, particularly KrF excimer laser light or EUV light, and to provide a positive resist composition giving a good side lobe margin. SOLUTION: The positive resist composition comprises: (A) a resin containing a repeating unit having a secondary benzyl structure in a side chain; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; and (C) a tertiary amine compound. A pattern forming method using the same is also provided. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To solve the problems of a performance improving technique in the microfabrication of a semiconductor element using an actinic ray or radiation, and to provide a positive photosensitive composition which is improved in pattern collapse, ensures few development defects and excels in various performances such as resolution, isolated DOF and PEB temperature dependency, even in the formation of a fine pattern of ≤100 nm, and a method of forming a pattern using the same. SOLUTION: The positive photosensitive composition includes: a resin whose dissolution rate in an alkaline developing solution increases by the action of an acid, the resin containing a specific acid decomposable repeating unit and a specific acid nondecomposable repeating unit; and a compound capable of generating an acid upon irradiation with an actinic ray or radiation. The method of forming a pattern using the same is also provided. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a surface treating agent for a resist pattern suitable for a freezing process, in which properties of a first resist pattern can be modified in a double patterning method such that the first resist pattern does not dissolve in a resist liquid or a developer used for forming a second resist pattern and that changes in the width, line width ratio (LWR) and height of the first pattern are suppressed even after the second resist patter is formed, and to provide a method of forming a resist pattern by using the surface treating agent. SOLUTION: The surface treating agent for a resist pattern contains a chemical species having a polymerizable group and a functional group that chemically adsorbs to a resist pattern, and a solvent. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide: a photosensitive resin composition having excellent lithography performance and capable of forming a cured relief pattern excellent in mechanical characteristics and heat resistance through low-temperature curing; a cured relief pattern production method using the photosensitive resin composition; and a semiconductor device including a cured relief pattern obtained by the production method. SOLUTION: The photosensitive resin composition comprises a resin comprising a specific repeating unit, a photosensitive agent, a thermo-acid generator, and a compound having at least one of an alkoxymethyl group and an acyloxymethyl group. There are also provided: the cured relief pattern production method using the photosensitive resin composition; and the semiconductor device including a cured relief pattern obtained by the production method. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes and a pattern forming method using the same, which are a positive resist composition improved in line edge roughness, PEB temperature dependency and profile and a pattern forming method using the same. SOLUTION: The positive resist composition contains (A) a resin having a specific repeating unit (A1) and a specific repeating unit (A2) and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation. The pattern forming method using the same is also provided. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a new surface treating agent for a freezing process, with which, in a freezing process, the height of a first resist pattern does not change upon surface treatment and the formation of a second resist pattern, and the line width roughness (LWR) of the first resist pattern does not change even after surface treatment and the formation of the second resist pattern, and to provide a pattern forming method using the same. SOLUTION: The surface treating agent for pattern formation contains a compound having an aziridinyl group. The pattern forming method uses the surface treating agent. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent lithography performance and stability and capable of forming a cured relief pattern excellent in mechanical characteristics, heat resistance and adhesion to a substrate by low-temperature cure, a method for producing a cured relief pattern using the photosensitive resin composition, and a semiconductor device including a cured relief pattern obtained by using the method. SOLUTION: The photosensitive resin composition comprises a polybenzoxazole precursor, a photosensitizing agent and a compound having an oxetane group. There are also provided the method for producing a cured relief pattern using the photosensitive resin composition, and a semiconductor device including a cured relief pattern obtained by using the method. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a surface treatment agent for a freezing process satisfying the following requirements: (1) a line width of a first resist pattern is not changed; and (2) a line edge roughness (LER) of the first resist pattern is not deteriorated, by freezing treatment, in the freezing process to be applied to the first resist pattern in a double patterning method, and to provide a pattern forming method using the same. SOLUTION: This surface treatment agent for forming the resist pattern contains a compound having a carbodiimide group. COPYRIGHT: (C)2010,JPO&INPIT