公开(公告)号：US20240351862A1

公开(公告)日：2024-10-24

申请号：US18652726

申请日：2024-05-01

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Vikram Mukundan ,  Seshagiri Rao Madhavapeddy ,  Ananth Saran Yalamarthy ,  Prathima Kapa ,  Brian James Gally

IPC: B81B7/00

CPC classification number: B81B7/0061 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2203/058

Abstract: A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid through the orifices. The support structure couples the cooling element to the bottom plate. The support structure is coupled with at least one of the cooling element or the bottom plate by diffusion bond(s).

公开(公告)号：US11802554B2

公开(公告)日：2023-10-31

申请号：US17081890

申请日：2020-10-27

Applicant: Frore Systems Inc.

Inventor： Ananth Saran Yalamarthy ,  Vikram Mukundan ,  Suryaprakash Ganti ,  Narayana Prasad Rayapati ,  Prabhu Sathyamurthy ,  Seshagiri Rao Madhavapeddy ,  Marc Mignard ,  Brian James Gally

IPC: F04B43/04 ,  F04B49/00 ,  F04B45/047

CPC classification number: F04B43/046 ,  F04B45/047 ,  F04B49/00

Abstract: A system including an orifice plate, a fan element and at least one channel is disclosed. The orifice plate has at least one orifice therein. The fan element is configured to undergo vibrational motion to drive a fluid through the orifice(s). The fluid is drawn through the channel(s) in response to the fluid being driven through the at least one orifice.

公开(公告)号：US11533823B2

公开(公告)日：2022-12-20

申请号：US17121607

申请日：2020-12-14

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Brian James Gally ,  Prabhu Sathyamurthy ,  Seshagiri Rao Madhavapeddy

IPC: H05K7/20 ,  H04B1/3888

Abstract: A mobile device case is described. The mobile device case includes a housing configured to retain a mobile device and an active cooling system integrated into the housing. The active cooling system configured to use vibrational motion to cool a surface of the mobile device.

公开(公告)号：US20220087059A1

公开(公告)日：2022-03-17

申请号：US17475252

申请日：2021-09-14

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Prathima Kapa ,  Seshagiri Rao Madhavapeddy ,  Shekhar Halakatti ,  Brian James Gally

IPC: H05K7/20 ,  H01L23/467 ,  H01L23/473

Abstract: A system including a tile and a hood is described. The tile includes a plurality of cooling cells. Each of the cooling cells includes a support structure and a cooling element. The cooling element is supported by the support structure and is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The hood is coupled to the tile and directs the fluid around the plurality of cooling cells.

公开(公告)号：US20220081284A1

公开(公告)日：2022-03-17

申请号：US17474815

申请日：2021-09-14

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan ,  Ananth Saran Yalamarthy ,  Prabhu Sathyamurthy ,  Brian James Gally

IPC: B81B7/00 ,  H05K7/20

Abstract: A system including a plurality of cooling cells is described. Each of the cooling cells includes a support structure and a cooling element. The cooling element has a central region having an axis and a perimeter. The cooling element IS supported by the support structure at the central region and along the axis. At least a portion of the perimeter being unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. A portion of the cooling cells aligned along the axis are physically connected such that the cooling cells form an integrated cooling cell tile.

公开(公告)号：US20250027729A1

公开(公告)日：2025-01-23

申请号：US18818364

申请日：2024-08-28

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Vikram Mukundan ,  Sangkyu Kim ,  Prathima Kapa ,  Seshagiri Rao Madhavapeddy ,  Shekhar Halakatti ,  Brian James Gally

IPC: F28F13/10 ,  F04B43/02 ,  H05K7/20

Abstract: A heat transfer system includes fluid transfer cells that vibrationally move a fluid and a thermally conductive cover that conducts heat from the cells while avoiding transfer of mechanical energy between the cells. A fluid transfer module includes outer and inner walls, a support member, and a membrane. The outer wall has an outer opening. The inner wall has an inner opening. The support member is disposed laterally on the inner wall such that a flow chamber is defined between the outer and inner walls. The membrane is supported by the support member along the outer wall. A fluid transfer module includes an inlet port and an actuator. The actuator undergoes vibrational motion and has first and second vibrational modes. The first vibrational mode causes fluid to enter the inlet port. The second vibrational mode expels fluid from the inlet port, which reduces clogging of the inlet port.

公开(公告)号：US12052924B2

公开(公告)日：2024-07-30

申请号：US16723363

申请日：2019-12-20

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Leonard Eugene Fennell ,  Ming Tung ,  Brian James Gally

IPC: H10N30/50 ,  H10N30/067 ,  H10N30/20 ,  H10N30/85 ,  H10N30/87 ,  H04L41/083

CPC classification number: H10N30/50 ,  H10N30/067 ,  H10N30/206 ,  H10N30/85 ,  H10N30/871

Abstract: A method for providing a piezoelectric device is described. The method includes providing a first electrode layer on a substrate and coating at least one layer of piezoelectric material. The coating using at least one of slot-die coating, dip coating, aerosol coating and R2R coating such that a layer of the at least one layer of piezoelectric material has a variation in thickness of not more than ten percent. The layer(s) of piezoelectric materials are also heat treated. Multiple layers of piezoelectric material may be slot-die coated and heat treated to provide a multilayer having the desired thickness. A second electrode layer is provided on the layer(s) of piezoelectric material.

公开(公告)号：US20220087064A1

公开(公告)日：2022-03-17

申请号：US17468151

申请日：2021-09-07

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Brian James Gally ,  Ming-Hau Tung ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan ,  Ananth Saran Yalamarthy ,  Leonard Eugene Fennell

IPC: H05K7/20 ,  H01L23/473

Abstract: A method for providing a cooling system is described. The method includes providing a plurality of sheets. Each sheet includes at least one structure for a level in each cooling cell of a plurality of cooling cells. A particular level of each cooling cell includes a cooling element having a first side and a second side. The cooling element is configured to undergo vibrational motion to drive fluid from the first side to the second side. The method also includes aligning the sheets, attaching the sheets to form a laminate that includes the cooling cells, and separating the laminate into sections. Each section includes at least one cooling cell.

公开(公告)号：US20210193900A1

公开(公告)日：2021-06-24

申请号：US16723363

申请日：2019-12-20

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Leonard Eugene Fennell ,  Ming Tung ,  Brian James Gally

IPC: H01L41/083 ,  H01L41/09 ,  H01L41/047 ,  H01L41/18 ,  H01L41/297

Abstract: A method for providing a piezoelectric device is described. The method includes providing a first electrode layer on a substrate and coating at least one layer of piezoelectric material. The coating using at least one of clot-die coating, dip coating, aerosol coating and R2R coating such that a layer of the at least one layer of piezoelectric material has a variation in thickness of not more than ten percent. The layer(s) of piezoelectric materials are also heat treated. Multiple layers of piezoelectric material may be slot-die coated and heat treated to provide a multilayer having the desired thickness. A second electrode layer is provided on the layer(s) of piezoelectric material.

公开(公告)号：US20250142784A1

公开(公告)日：2025-05-01

申请号：US18939317

申请日：2024-11-06

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan ,  Narayana Prasad Rayapati ,  Brian James Gally ,  William Finn Ninian Paisley

IPC: H05K7/20

Abstract: A thermal management system is described. The thermal management system includes a heat sink structure and an array of microelectromechanical system (MEMS) jets. The heat sink structure is in thermal communication with a plurality of heat sources. The heat sink structure includes fins and a collection channel. The array of MEMS jets is arranged to cause a fluid to impinge on a surface of each of the fins and to be directed through the collection channel.