公开(公告)号：US20030125895A1

公开(公告)日：2003-07-03

申请号：US10265411

申请日：2002-10-07

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Takayoshi Kawai ,  Kazuo Mitsui

IPC: G06F019/00

CPC classification number: H05K13/08

Abstract: Where a result of operations to mount electronic components is inspected, for example, an operating procedure of an inspecting operation is determined on the basis of mounting-condition information such as used-device information relating to used suction nozzles, feeders and other devices, and mounting-result information such as information relating to recovery actions. The operating procedure may be determined on the basis of device-usage hysteresis information as well. For instance, the inspection operation is performed on inspecting objects selected from the mounting objects, such as mounting objects mounted with nozzles of high mounting defect ratios, mounting objects mounted with feeders of long use, etc. Additional inspecting objects are selected such that each mounting object is inspected at a predetermined frequency or such that the inspection can be effected within a predetermined time. The inspecting order may be determined so as to complete the inspection in a shortest possible time.

Abstract translation: 在检查安装电子部件的操作结果的情况下，例如，基于与使用的吸嘴，馈线等装置有关的使用设备信息等安装条件信息来确定检查动作的操作程序，以及 安装结果信息，例如与恢复动作有关的信息。 操作过程也可以基于设备使用滞后信息来确定。 例如，对从安装对象中选择的物体进行检查，例如安装有高安装缺陷比率的喷嘴的安装对象，安装有长期使用的进料器的安装对象等进行检查操作。选择附加的检查对象，使得每个安装 物体以预定频率进行检查，或者可以在预定时间内进行检查。 可以确定检查顺序，以便在最短的时间内完成检查。

公开(公告)号：US20030059964A1

公开(公告)日：2003-03-27

申请号：US10245371

申请日：2002-09-18

Applicant: Fuji Machine Mfg. Co., Ltd.

Inventor： Takayoshi Kawai ,  Kazuo Mitsui ,  Seigo Kodama

IPC: H01L021/66 ,  G01R031/26 ,  H01L021/76 ,  H01L021/00

CPC classification number: H01L22/20 ,  G05B19/4183 ,  G05B2219/32049 ,  G05B2219/45031 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/014 ,  H05K1/0269 ,  H05K3/00 ,  Y02P90/10 ,  Y10T29/41 ,  H01L2924/00

Abstract: A method of fabricating an electric circuit, including first and second working processes of performing respective first and second working operations on a circuit substrate, wherein the first working process includes a first substrate-identifying step of obtaining substrate identifying information identifying the substrate on which the first working operation is to be performed, a specific-information obtaining step of recognizing a specific-information providing portion of the substrate, to obtain specific information indicating at least one specific characteristic of the substrate, a first working step of performing the first working operation on the basis of the obtained specific information, and a specific-information storing step of storing the specific information in relation to the substrate identifying information, and the second working process includes a second substrate-identifying step of obtaining the substrate identifying information identifying the substrate on which the second working operation is to be performed, and a second working step of performing the second working operation on the basis of the specific information stored in relation to the substrate identifying information. Also disclosed are electric-circuit fabricating system and control program suitable to practice the method.

Abstract translation: 一种制造电路的方法，包括在电路基板上执行各自的第一和第二工作操作的第一和第二工作过程，其中所述第一工作过程包括第一衬底识别步骤，用于获得标识衬底的衬底识别信息， 要执行第一工作操作，特定信息获取步骤，识别衬底的特定信息提供部分，以获得指示衬底的至少一个特定特性的特定信息;执行第一工作操作的第一工作步骤 基于所获得的具体信息，以及特定信息存储步骤，用于存储关于衬底识别信息的特定信息，并且第二工作过程包括第二衬底识别步骤，获得识别衬底的衬底识别信息 在哪 将执行第二工作操作，以及第二工作步骤，其基于与衬底识别信息相关的存储的特定信息执行第二工作操作。 还公开了适用于实施该方法的电路制造系统和控制程序。

公开(公告)号：US20030059961A1

公开(公告)日：2003-03-27

申请号：US10245365

申请日：2002-09-18

Applicant: Fuji Machine Mfg. Co., Ltd.

Inventor： Seigo Kodama ,  Takayoshi Kawai ,  Kazuo Mitsui

IPC: H01L021/00

CPC classification number: H01L21/67294 ,  H01L21/67276 ,  H05K1/0266 ,  H05K1/0269 ,  H05K3/0008 ,  H05K2201/09918 ,  H05K2201/09927

Abstract: An electric-circuit fabricating system for fabricating an electric circuit, by performing a working operation on a circuit substrate, including a substrate holding device to hold the substrate, an imaging device to image a surface of the substrate on which the working operation is to be performed, an imaging control device to control the imaging device to take an image of a substrate-position fiducial mark provided on the substrate, and obtaining substrate-position information on the basis of the image, and a working device to perform the working operation on the substrate, on the basis of the substrate-position information, and wherein the imaging control device is operable to control the imaging device to take an image of a substrate ID mark provided on the substrate as held by the substrate holding device, for obtaining substrate identifying information identifying the substrate, on the basis of the image of the substrate ID mark. Also disclosed are a method and a control program for fabricating an electric circuit by performing the working operation on the substrate.

Abstract translation: 一种用于制造电路的电路制造系统，通过对包括用于保持基板的基板保持装置的电路基板执行工作操作，成像装置对要进行工作操作的基板的表面进行成像 执行成像控制装置，用于控制成像装置拍摄设置在基板上的基板位置基准标记的图像，并且基于图像获得基板位置信息;以及工作装置，用于对 所述基板基于所述基板位置信息，并且其中所述成像控制装置可操作以控制所述成像装置拍摄由所述基板保持装置保持在所述基板上的基板ID标记的图像，以获得基板 基于基板ID标记的图像识别识别基板的信息。 还公开了一种通过在基板上进行加工操作来制造电路的方法和控制程序。