公开(公告)号：US11597036B2

公开(公告)日：2023-03-07

申请号：US16594828

申请日：2019-10-07

Applicant: Fujitsu Optical Components Limited

Inventor： Kohei Shibata ,  Tatsuya Ito

IPC: B23K26/08 ,  G02B6/42 ,  B23K26/20 ,  H01L31/18 ,  H04B10/40 ,  B23K103/00 ,  B23K101/40

Abstract: An optical module includes an optical semiconductor chip having a first surface that includes a laser beam irradiation region and a cleavage region, an optical fiber optically coupled to the first surface, and a support member having a second surface bonded to the first surface, and configured to support the optical fiber. The optical semiconductor chip has an optical signal input and output part located in the cleavage region, and the second surface is bonded to the first surface within the cleavage region.