Polishing mechanism, polishing device, and polishing method

    公开(公告)号:US11883928B2

    公开(公告)日:2024-01-30

    申请号:US17322247

    申请日:2021-05-17

    CPC classification number: B24B9/00 B24B51/00

    Abstract: A mechanism for polishing includes a polishing member, an eccentric member coupled to the polishing member, and a driving member coupled to the eccentric member. The driving member drives the eccentric member to rotate to move the polishing member to reciprocate in the one-dimensional direction, so that when a relative position between the polishing mechanism and the workpiece is fixed, the polishing member polishes a workpiece by translating a polishing surface. A method for the polishing process, applied by a polishing device, is also disclosed. By using the polishing mechanism, the entirety of the polishable surface of the workpiece can be covered, and collapsed edges of the workpiece are avoided.

Patent Agency Ranking