METHOD FOR MAKING AN ANTI-CRACK ELECTRONIC DEVICE
    1.
    发明申请
    METHOD FOR MAKING AN ANTI-CRACK ELECTRONIC DEVICE 审中-公开
    制造抗裂电子器件的方法

    公开(公告)号:US20160125284A1

    公开(公告)日:2016-05-05

    申请号:US14896094

    申请日:2014-06-03

    Applicant: GEMALTO SA

    Abstract: A method for making an intermediate electronic device, wherein said device is coated or is to be coated with a cover sheet or layer, the method comprising the step of forming a carrier-body comprising: a cavity provided in the carrier-body; an electric circuit comprising at least one electric interconnection area inside the cavity; an electronic module comprising at least one connection pad connecting said interconnection area and arranged in the cavity; a space or gap provided at the interface between the module and the carrier-body, substantially perpendicular to a main surface of the carrier-body, in communication with the surface of the carrier-body, and intended to be covered with a cover sheet or layer; the method is characterized in that a flexible or elastic material is arranged in the device so as to fill the space or gap between the module and the body-carrier or at least partially cover same.

    Abstract translation: 一种制造中间电子器件的方法,其中所述器件被涂覆或将被覆盖片或层,该方法包括形成载体的步骤,包括:设置在载体中的腔体; 电路,其包括所述腔内的至少一个电互连区域; 电子模块,包括连接所述互连区域并布置在空腔中的至少一个连接焊盘; 设置在模块和载体之间的界面处的空间或间隙,其基本上垂直于载体主体的主表面,与载体主体的表面连通,并且旨在被覆盖片或 层; 该方法的特征在于,在装置中布置柔性或弹性材料,以便填充模块和身体载体之间的空间或间隙,或至少部分地覆盖其上。

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