公开(公告)号：US20180323139A1

公开(公告)日：2018-11-08

申请号：US15773673

申请日：2016-10-28

Applicant: GEMALTO SA

Inventor： Line Degeilh ,  Remy Janvrin ,  Lucile Dossetto ,  Alain Le Loc'h ,  Jean-Christophe Fidalgo

IPC: H01L23/498 ,  H01L21/48 ,  G06K19/07

CPC classification number: H01L23/49855 ,  G06K19/00 ,  G06K19/0723 ,  H01L21/4867 ,  H01L2224/49171

Abstract: The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.

公开(公告)号：US10091883B2

公开(公告)日：2018-10-02

申请号：US14903770

申请日：2014-06-19

Applicant: GEMALTO SA

Inventor： Stéphane Ottobon ,  Lucile Dossetto ,  Line Degeilh

IPC: H05K5/02 ,  H05K1/18 ,  G06K19/077 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  H05K7/18 ,  H01R9/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/495 ,  H01L33/62

Abstract: The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.

公开(公告)号：US20180351233A1

公开(公告)日：2018-12-06

申请号：US15780465

申请日：2016-12-13

Applicant: GEMALTO SA

Inventor： Remy Janvrin ,  Line Degeilh ,  Lucile Dossetto ,  Stéphane Ottobon

IPC: H01Q1/22

Abstract: The invention relates to a module with integrated circuit chip, comprising an insulating substrate, metallisations comprising conductive tracks produced on one side of the substrate, forming an antenna and comprising two connection ends, and a coating area or location of the radiofrequency integrated circuit chip and of a device in the form of a surface-mounted device, the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna. The metallisations are on a single same side of the insulating substrate, the connection being made by means of perforations through the insulating film or directly on the surface metallisations.

公开(公告)号：US20150228505A1

公开(公告)日：2015-08-13

申请号：US14424124

申请日：2013-09-17

Applicant: GEMALTO SA

Inventor： Stéphane Ottobon ,  Lucile Dossetto ,  Laurent Audouard ,  Sébastien Guijarro

IPC: H01L21/48

CPC classification number: H01L21/4803 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention concerns a method for producing a smart card or telecommunication module electronic housing, comprising an electronic chip in the housing, a face comprising at least one set of conductive metal platings, said method comprising the following steps: providing or producing at least one set of metal platings comprising conductive circuit pads or tracks, on one side of a substrate, transferring and connecting a chip to each set of platings, overmoulding each chip with the set of metal platings of same on the substrate with a moulding material in order to produce at least one housing, separating the housing from the substrate thereof, wherein the side of the substrate in contact with the metal platings comprises an adhesive or has low adhesiveness and in that the overmoulding is carried out at the final dimensions of the housing. The invention also concerns a moulding apparatus and the housing obtained.

Abstract translation: 本发明涉及一种用于生产智能卡或电信模块电子外壳的方法，包括壳体中的电子芯片，包括至少一组导电金属电镀的面，所述方法包括以下步骤：提供或产生至少一组 的金属电镀包括导电电路板或轨道，在基板的一侧上，将芯片转移并连接到每组电镀板，用模制材料在基板上用其一组金属镀覆盖每个芯片，以便产生 至少一个壳体，其将所述壳体与其基底分离，其中与所述金属镀层接触的所述基底的侧面包括粘合剂或具有低粘合性，并且所述包覆成型在所述壳体的最终尺寸下进行。 本发明还涉及一种成型设备和获得的壳体。

公开(公告)号：US10658283B2

公开(公告)日：2020-05-19

申请号：US15773673

申请日：2016-10-28

Applicant: GEMALTO SA

Inventor： Line Degeilh ,  Remy Janvrin ,  Lucile Dossetto ,  Alain Le Loc'h ,  Jean-Christophe Fidalgo

IPC: H01L21/00 ,  H01L23/498 ,  H01L21/48 ,  G06K19/07 ,  G06K19/00

Abstract: The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.

公开(公告)号：US10282652B2

公开(公告)日：2019-05-07

申请号：US15531159

申请日：2016-02-09

Applicant: GEMALTO SA

Inventor： Stéphane Ottobon ,  Lucile Dossetto ,  Luc Charles ,  Thierry Laviron

IPC: G06K19/077

Abstract: The invention relates to a method for producing a module having an electronic chip including metallizations which are accessible from a first side of the metallizations and an integrated circuit chip which is arranged on the second side of the metallizations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallizations, directly connecting the chip, and are arranged on the second side of the metallizations. The invention also relates to a module corresponding to the method and to a device comprising said module.

公开(公告)号：US10804594B2

公开(公告)日：2020-10-13

申请号：US15780465

申请日：2016-12-13

Applicant: GEMALTO SA

Inventor： Remy Janvrin ,  Line Degeilh ,  Lucile Dossetto ,  Stéphane Ottobon

IPC: H01Q1/22 ,  H01Q7/00

Abstract: The invention relates to a module with integrated circuit chip, comprising an insulating substrate, metallisations comprising conductive tracks produced on one side of the substrate, forming an antenna and comprising two connection ends, and a coating area or location of the radiofrequency integrated circuit chip and of a device in the form of a surface-mounted device, the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna. The metallisations are on a single same side of the insulating substrate, the connection being made by means of perforations through the insulating film or directly on the surface metallisations.

公开(公告)号：US20140367473A1

公开(公告)日：2014-12-18

申请号：US14365281

申请日：2012-12-07

Applicant: GEMALTO SA

Inventor： Stéphane Ottobon ,  Lucile Dossetto

IPC: G06K19/077 ,  H01L21/56

CPC classification number: G06K19/07728 ,  G06K19/077 ,  G06K19/07722 ,  G06K19/07743 ,  G06K19/07745 ,  H01L21/56 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48228 ,  H01L2924/00011 ,  H01L2924/19107 ,  H01L2924/01005 ,  H01L2924/00014

Abstract: This invention relates to a smart card (1) manufacturing method that makes it possible to reduce the thickness of the said smart card and directly obtain a final 3FF or 4FF format. The smart card manufacturing method comprises steps for depositing resin forming a first protective coat (11) over the electronic element assembly with a surface greater than the required smart card format and depositing a second protective coat with a format larger than the required card format on the first protective coat. The second protective coat is fixed to the first protective coat by curing the first protective coat, and then the assembly obtained in that way is cut to the required format.

Abstract translation: 智能卡（1）制造方法技术领域本发明涉及一种智能卡（1）的制造方法，其能够减小所述智能卡的厚度并直接获得最终的3FF或4FF格式。 智能卡制造方法包括以下步骤：在电子元件组件上形成第一保护涂层（11）的树脂，其表面大于所需的智能卡格式，并将尺寸大于所需卡格式的第二保护涂层沉积在 第一防护外套。 通过固化第一保护涂层将第二保护涂层固定到第一保护涂层，然后将以该方式获得的组件切割成所需格式。