Method for producing a radio-frequency device maintaining anisotropic connection

    公开(公告)号:US10102468B2

    公开(公告)日:2018-10-16

    申请号:US14896159

    申请日:2014-06-02

    Applicant: GEMALTO SA

    Abstract: The invention relates to a method for producing an intermediate device comprising an electronic module, said intermediate device being used to receive at least one film or portion of a film or covering layer, said device comprising: a supporting body; at least one area for the interconnection of an electric circuit, borne by the supporting body; and an electronic module connected to said interconnection area by an anisotropic connection material, said material being compressed between said area and the module. The method comprises the implementation of a means for maintaining the compressed state of said anisotropic material and/or a means for isolating said material from the outside of the supporting body.

    Method for producing conducting tracks on a substrate

    公开(公告)号:US10599971B2

    公开(公告)日:2020-03-24

    申请号:US15772964

    申请日:2016-11-14

    Applicant: GEMALTO SA

    Abstract: Method of producing wire inlaid on a support and inlaid wire obtained. The invention relates to an antenna for radiofrequency transponder, said antenna comprising conducting wire portions which are to a major extent inlaid and conducting wire portions which are to a minor extent non-inlaid on a plane support. The antenna is characterized in that said wire portions which are to a minor extent non-inlaid extend over or cross at least one favoured fold line and/or one fold line predefined according to a standardized folding resistance test. The invention also relates to a portable electronic object comprising said antenna and a corresponding method of production.

    SECURE ASSEMBLY OF DOCUMENTS OR MEDIA
    3.
    发明申请

    公开(公告)号:US20190311997A1

    公开(公告)日:2019-10-10

    申请号:US16466825

    申请日:2017-12-07

    Applicant: GEMALTO SA

    Abstract: The invention relates to a method for producing a security document, wherein a body is created that comprises two superimposed layers, a circuit which is electric and/or has an electronic chip arranged on the interface between the two layers, and a first adhesive between the two layers, which adheres to the two layers and/or the circuit. The method includes a step of depositing a second adhesive which is different from, or has a different behaviour from, the first adhesive in relation to the solvents or the temperature and partially adheres to at least one of the two layers and/or the circuit.

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